Jaime A. Bayan

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin foil semiconductor package
- Patent number 8,857,047
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,747,640
- Issue date Jun 10, 2014
- Texas Instruments Incorporated
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
DC/DC converter power module package incorporating a stacked contro...
- Patent number 8,679,896
- Issue date Mar 25, 2014
- National Semiconductor Corporation
- Rajeev Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked leadframe implementation for DC/DC convertor power module i...
- Patent number 8,450,149
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,377,267
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making foil based semiconductor package
- Patent number 8,375,577
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Will Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin foil semiconductor package
- Patent number 8,341,828
- Issue date Jan 1, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and leadframe for packaging integrated circuits
- Patent number 8,298,871
- Issue date Oct 30, 2012
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 8,293,573
- Issue date Oct 23, 2012
- Texas Instruments Incorporated
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple leadframe package
- Patent number 8,222,716
- Issue date Jul 17, 2012
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil based semiconductor package
- Patent number 8,101,470
- Issue date Jan 24, 2012
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with molded insulation
- Patent number 7,944,032
- Issue date May 17, 2011
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package
- Patent number 7,923,825
- Issue date Apr 12, 2011
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 7,893,523
- Issue date Feb 22, 2011
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and leadframe structure
- Patent number 7,859,090
- Issue date Dec 28, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin foil semiconductor package
- Patent number 7,836,586
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package
- Patent number 7,705,476
- Issue date Apr 27, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal laminator
- Patent number 7,678,617
- Issue date Mar 16, 2010
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microarray package with plated contact pedestals
- Patent number 7,671,452
- Issue date Mar 2, 2010
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 7,619,303
- Issue date Nov 17, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging integrated circuits
- Patent number 7,612,435
- Issue date Nov 3, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with molded insulation
- Patent number 7,608,482
- Issue date Oct 27, 2009
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and microarray leadframe structure
- Patent number 7,598,122
- Issue date Oct 6, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gang flipping for IC packaging
- Patent number 7,491,625
- Issue date Feb 17, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package substitute and stack package
- Patent number 7,432,583
- Issue date Oct 7, 2008
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach pad for use in semiconductor manufacturing and method of...
- Patent number 7,227,245
- Issue date Jun 5, 2007
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a micro-array integrated circuit package
- Patent number 7,186,588
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal clamping mechanism
- Patent number 7,181,835
- Issue date Feb 27, 2007
- National Semiconductor Corporation
- Ah Lek Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for use in semiconductor manufacturing and method of maki...
- Patent number 7,102,209
- Issue date Sep 5, 2006
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pad configuration for use in a micro-array integrated circui...
- Patent number 7,087,986
- Issue date Aug 8, 2006
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DC/DC Converter Power Module Package Incorporating a Stacked Contro...
- Publication number 20130214399
- Publication date Aug 22, 2013
- National Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Foil Plating for Semiconductor Packaging
- Publication number 20130026043
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thin Foil Semiconductor Package
- Publication number 20130019469
- Publication date Jan 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTRO...
- Publication number 20120326287
- Publication date Dec 27, 2012
- National Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
- Publication number 20120119343
- Publication date May 17, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS
- Publication number 20110269269
- Publication date Nov 3, 2011
- National Semiconductor Corporation
- Nghia T. TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20110104854
- Publication date May 5, 2011
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE LEADFRAME PACKAGE
- Publication number 20110089546
- Publication date Apr 21, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20110074003
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Anindya PODDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL PLATING FOR SEMICONDUCTOR PACKAGING
- Publication number 20110073481
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20110023293
- Publication date Feb 3, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS
- Publication number 20100136749
- Publication date Jun 3, 2010
- National Semiconductor Corporation
- Jaime BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS
- Publication number 20100117206
- Publication date May 13, 2010
- National Semiconductor Corporation
- Jaime BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS
- Publication number 20100084748
- Publication date Apr 8, 2010
- National Semiconductor Corporation
- Anindya PODDAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20100046188
- Publication date Feb 25, 2010
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20100025818
- Publication date Feb 4, 2010
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MOLDED INSULATION
- Publication number 20100001383
- Publication date Jan 7, 2010
- National Semiconductor Corporation
- Jaime BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH METHOD AND LEADFRAME STRUCTURE
- Publication number 20090315161
- Publication date Dec 24, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20090305076
- Publication date Dec 10, 2009
- National Semiconductor Corporation
- Will Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUITS
- Publication number 20090160037
- Publication date Jun 25, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20090160067
- Publication date Jun 25, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20090160039
- Publication date Jun 25, 2009
- National Semiconductor Corporation
- Will K. WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20090115035
- Publication date May 7, 2009
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUITS
- Publication number 20080290482
- Publication date Nov 27, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SOLDER PADS
- Publication number 20080237814
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG FLIPPING FOR IC PACKAGING
- Publication number 20080241993
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG FLIPPING FOR FLIP-CHIP PACKAGING
- Publication number 20080241991
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced solder joint strength and ease of inspection of leadless l...
- Publication number 20050116321
- Publication date Jun 2, 2005
- National Semiconductor Corporation, A Delaware Corp.
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless leadframe package substitute and stack package
- Publication number 20050001294
- Publication date Jan 6, 2005
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal clamping mechanism
- Publication number 20040143962
- Publication date Jul 29, 2004
- National Semiconductor Corporation
- Ah Lek Hu
- H01 - BASIC ELECTRIC ELEMENTS

Jaime A. Bayan

Person

Patents Grantslast 30 patents

Thin foil semiconductor package

Foil plating for semiconductor packaging

DC/DC converter power module package incorporating a stacked contro...

Stacked leadframe implementation for DC/DC convertor power module i...

Foil plating for semiconductor packaging

Method of making foil based semiconductor package

Thin foil semiconductor package

Method and leadframe for packaging integrated circuits

Microarray package with plated contact pedestals

Multiple leadframe package

Foil based semiconductor package

Integrated circuit package with molded insulation

Integrated circuit package

Microarray package with plated contact pedestals

Die attach method and leadframe structure

Thin foil semiconductor package

Integrated circuit package

Universal laminator

Microarray package with plated contact pedestals

Integrated circuit package

Method of packaging integrated circuits

Integrated circuit package with molded insulation

Die attach method and microarray leadframe structure

Gang flipping for IC packaging

Leadless leadframe package substitute and stack package

Die attach pad for use in semiconductor manufacturing and method of...

Method of fabricating a micro-array integrated circuit package

Universal clamping mechanism

Substrate for use in semiconductor manufacturing and method of maki...

Solder pad configuration for use in a micro-array integrated circui...

Patents Applicationslast 30 patents

DC/DC Converter Power Module Package Incorporating a Stacked Contro...

Foil Plating for Semiconductor Packaging

Thin Foil Semiconductor Package

DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTRO...

STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

MULTIPLE LEADFRAME PACKAGE

FOIL BASED SEMICONDUCTOR PACKAGE

FOIL PLATING FOR SEMICONDUCTOR PACKAGING

THIN FOIL SEMICONDUCTOR PACKAGE

MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

THIN FOIL SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT PACKAGE WITH MOLDED INSULATION

DIE ATTACH METHOD AND LEADFRAME STRUCTURE

FOIL BASED SEMICONDUCTOR PACKAGE

METHOD OF PACKAGING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGE

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGE

METHOD OF PACKAGING INTEGRATED CIRCUITS

ISOLATED SOLDER PADS

GANG FLIPPING FOR IC PACKAGING

GANG FLIPPING FOR FLIP-CHIP PACKAGING

Enhanced solder joint strength and ease of inspection of leadless l...

Leadless leadframe package substitute and stack package

Universal clamping mechanism