James A Burk

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Simpsonville, SC, US

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Patents Grantslast 30 patents

Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,757,811
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,178,770
- Issue date Jan 8, 2019
- Kemet Electronics Corporation
- James A Burk
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Component Assemblies and Embedding for High Density Electronics
- Publication number 20210227693
- Publication date Jul 22, 2021
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Higher Density Multi-Component and Serial Packages
- Publication number 20190200457
- Publication date Jun 27, 2019
- Kemet Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS