James A. Jones

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for force transfer via bare die package
- Patent number 6,836,408
- Issue date Dec 28, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM heat sink assembly and method of assembling
- Patent number 6,243,264
- Issue date Jun 5, 2001
- Sun Microsystems, Inc.
- Vernon P. Bollesen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical extraction tool for semiconductor packaged devices
- Patent number 5,979,955
- Issue date Nov 9, 1999
- Sun Microsystems, Inc.
- Mary Jane Krebser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for force transfer via bare die package
- Publication number 20040057213
- Publication date Mar 25, 2004
- Sun Microsystems, Inc.
- Vadim Gektin
- H01 - BASIC ELECTRIC ELEMENTS