James C. Davis

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-die memory device with peak current reduction
- Patent number 11,908,812
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Yui Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and method for over-voltage event protection
- Patent number 11,901,727
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- James Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with voltage protection mechanism
- Patent number 11,798,935
- Issue date Oct 24, 2023
- Micron Technology, Inc.
- James E. Davis
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices having 3-dimensional inductive structures
- Patent number 11,508,657
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 11,424,169
- Issue date Aug 23, 2022
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with voltage protection mechanism
- Patent number 11,398,468
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and method for over-voltage event protection
- Patent number 11,183,837
- Issue date Nov 23, 2021
- Micron Technology, Inc.
- James Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,930,645
- Issue date Feb 23, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,867,991
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,811,372
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having 3-dimensional inductive structures
- Patent number 10,784,192
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,580,767
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing capacitance of input/output pins...
- Patent number 10,453,829
- Issue date Oct 22, 2019
- Intel Corporation
- Merri Lyn Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,403,585
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,312,232
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,283,462
- Issue date May 7, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and method for over-voltage event protection
- Patent number 10,193,334
- Issue date Jan 29, 2019
- Micron Technology, Inc.
- James Davis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,128,229
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, circuits, and methods for protection circuits for dual...
- Patent number 9,391,062
- Issue date Jul 12, 2016
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and method for over-voltage event protection
- Patent number 9,281,682
- Issue date Mar 8, 2016
- Micron Technology, Inc.
- James Davis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Antifuse programming circuit with snapback select transistor
- Patent number 7,915,916
- Issue date Mar 29, 2011
- Micron Technology, Inc.
- William J. Wilcox
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
TRIPLE VIA CHAIN FOR ADVANCED INTERCONNECT IN A MEMORY DEVICE
- Publication number 20250014665
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Ivo Thomas Wambeke
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS OF MEMORY ARRAY DEVICE WITH LOW ARCING RISK
- Publication number 20240395325
- Publication date Nov 28, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAIN-BALLASTED ELECTROSTATIC DISCHARGE PROTECTION CIRCUITS
- Publication number 20240372360
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- James E. Davis
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING THROUGH-SILICON VIAS, AND RELATED...
- Publication number 20240290385
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE
- Publication number 20240233839
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE
- Publication number 20240136000
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
DISCHARGE CIRCUITS
- Publication number 20240071516
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kenneth W. Marr
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS WITH VOLTAGE PROTECTION MECHANISM
- Publication number 20240038759
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- James E. Davis
- G11 - INFORMATION STORAGE
Information Patent Application
WELL RING FOR RESISTIVE GROUND POWER DOMAIN SEGREGATION
- Publication number 20230017305
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Mattia Cichocki
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS
- Publication number 20230005799
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS WITH VOLTAGE PROTECTION MECHANISM
- Publication number 20220359495
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- James E. Davis
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-DIE MEMORY DEVICE WITH PEAK CURRENT REDUCTION
- Publication number 20220199554
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Yui Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION
- Publication number 20220069572
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- James Davis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS WITH VOLTAGE PROTECTION MECHANISM
- Publication number 20210183851
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20210175228
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS
- Publication number 20210043525
- Publication date Feb 11, 2021
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES HAVING 3-DIMENSIONAL INDUCTIVE STRUCTURES
- Publication number 20200373238
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20200212032
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20200152620
- Publication date May 14, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING 3-DIMENSIONAL INDUCTIVE STRUCTURES
- Publication number 20200144182
- Publication date May 7, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH THROUGH SILICON VIAS AND PACKAGE-LEVEL C...
- Publication number 20200035650
- Publication date Jan 30, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY
- Publication number 20190273052
- Publication date Sep 5, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20190148359
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION
- Publication number 20190148934
- Publication date May 16, 2019
- Micron Technology, Inc.
- James Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY
- Publication number 20190148314
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20190148358
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REDUCING CAPACITANCE OF INPUT/OUTPUT PINS...
- Publication number 20180366453
- Publication date Dec 20, 2018
- Intel Corporation
- Merri Lyn Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION
- Publication number 20160172847
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- James Davis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION
- Publication number 20140268438
- Publication date Sep 18, 2014
- Micron Technology, Inc.
- James Davis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUSES, CIRCUITS, AND METHODS FOR PROTECTION CIRCUITS FOR DUAL...
- Publication number 20130128399
- Publication date May 23, 2013
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS

James C. Davis

Person

Patents Grantslast 30 patents

Multi-die memory device with peak current reduction

Apparatuses and method for over-voltage event protection

Semiconductor devices with package-level configurability

Apparatus with voltage protection mechanism

Semiconductor devices having 3-dimensional inductive structures

Memory device including circuitry under bond pads

Apparatus with voltage protection mechanism

Apparatuses and method for over-voltage event protection

Semiconductor devices with through silicon vias and package-level c...

Semiconductor devices with package-level configurability

Semiconductor devices with package-level configurability

Semiconductor devices with post-probe configurability

Semiconductor devices having 3-dimensional inductive structures

Semiconductor devices with package-level configurability

Semiconductor devices with through silicon vias and package-level c...

Method and apparatus for reducing capacitance of input/output pins...

Semiconductor devices with post-probe configurability

Semiconductor devices with package-level configurability

Semiconductor devices with post-probe configurability

Apparatuses and method for over-voltage event protection

Semiconductor devices with package-level configurability

Apparatuses, circuits, and methods for protection circuits for dual...

Apparatuses and method for over-voltage event protection

Antifuse programming circuit with snapback select transistor

Patents Applicationslast 30 patents

TRIPLE VIA CHAIN FOR ADVANCED INTERCONNECT IN A MEMORY DEVICE

METHOD AND APPARATUS OF MEMORY ARRAY DEVICE WITH LOW ARCING RISK

DRAIN-BALLASTED ELECTROSTATIC DISCHARGE PROTECTION CIRCUITS

MICROELECTRONIC DEVICES INCLUDING THROUGH-SILICON VIAS, AND RELATED...

COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE

COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE

DISCHARGE CIRCUITS

APPARATUS WITH VOLTAGE PROTECTION MECHANISM

WELL RING FOR RESISTIVE GROUND POWER DOMAIN SEGREGATION

MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS

APPARATUS WITH VOLTAGE PROTECTION MECHANISM

MULTI-DIE MEMORY DEVICE WITH PEAK CURRENT REDUCTION

APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION

APPARATUS WITH VOLTAGE PROTECTION MECHANISM

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS

SEMICONDUCTOR DEVICES HAVING 3-DIMENSIONAL INDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR DEVICES HAVING 3-DIMENSIONAL INDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICES WITH THROUGH SILICON VIAS AND PACKAGE-LEVEL C...

SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION

SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

METHOD AND APPARATUS FOR REDUCING CAPACITANCE OF INPUT/OUTPUT PINS...

APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION

APPARATUSES AND METHOD FOR OVER-VOLTAGE EVENT PROTECTION

APPARATUSES, CIRCUITS, AND METHODS FOR PROTECTION CIRCUITS FOR DUAL...