Membership
Tour
Register
Log in
James C. Matayabas Jr.
Follow
Person
Gilbert, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
Patent number
11,881,440
Issue date
Jan 23, 2024
Intel Corporation
Marely E. Tejeda Ferrari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Liquid metal thermal interface material application
Patent number
11,679,407
Issue date
Jun 20, 2023
Intel Corporation
Kyle Jordan Arrington
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Integrated heat spreader comprising a silver and sintering silver l...
Patent number
11,562,940
Issue date
Jan 24, 2023
Intel Corporation
Elizabeth Nofen
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,545,407
Issue date
Jan 3, 2023
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packages and sinterable paste for use with thermal inter...
Patent number
11,404,349
Issue date
Aug 2, 2022
Intel Corporation
Nachiket R. Raravikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package having electromagnetic interference shielding
Patent number
11,189,574
Issue date
Nov 30, 2021
Intel Corporation
Li-Sheng Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LPS solder paste based low cost fine pitch pop interconnect solutions
Patent number
10,586,779
Issue date
Mar 10, 2020
Intel Corporation
Nachiket R. Raravikar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple-chip package with multiple thermal interface materials
Patent number
10,580,717
Issue date
Mar 3, 2020
Intel Corporation
Boxi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polymer thermal interface material having enhanced thermal conducti...
Patent number
10,056,314
Issue date
Aug 21, 2018
Intel Corporation
Randall D. Lowe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure to enhance yield of TMI interconnections
Patent number
10,049,971
Issue date
Aug 14, 2018
Intel Corporation
Thomas J. De Bonis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid low metal loading flux
Patent number
9,950,393
Issue date
Apr 24, 2018
Intel Corporation
Rajen S. Sidhu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Space transformer with perforated metallic plate for electrical die...
Patent number
9,941,652
Issue date
Apr 10, 2018
Intel Corporation
Nachiket R. Raravikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LPS solder paste based low cost fine pitch pop interconnect solutions
Patent number
9,831,206
Issue date
Nov 28, 2017
Intel Corporation
Nachiket R. Raravikar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible electronic assembly method
Patent number
9,820,384
Issue date
Nov 14, 2017
Intel Corporation
Sasha Oster
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Thermoset polymides for microelectronic applications
Patent number
9,646,903
Issue date
May 9, 2017
Intel Corporation
Stephen E. Lehman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
Patent number
9,640,415
Issue date
May 2, 2017
Intel Corporation
Randall D. Lowe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming wafer level underfill materials and structures f...
Patent number
9,631,065
Issue date
Apr 25, 2017
Intel Corporation
Anna M. Prakash
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure to enhance yield of TMI interconnections
Patent number
9,613,933
Issue date
Apr 4, 2017
Intel Corporation
Thomas J. De Bonis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlled fluid delivery in a microelectronic package
Patent number
9,604,210
Issue date
Mar 28, 2017
Intel Corporation
Lakshmi Supriya
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Controlled fluid delivery in a microelectronic package
Patent number
9,101,931
Issue date
Aug 11, 2015
Intel Corporation
Lakshmi Supriya
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Polymer thermal interface material having enhanced thermal conducti...
Patent number
9,070,660
Issue date
Jun 30, 2015
Intel Corporation
Randall Lowe
B32 - LAYERED PRODUCTS
Information
Patent Grant
Thermal interface material composition including polymeric matrix a...
Patent number
8,920,919
Issue date
Dec 30, 2014
Intel Corporation
Hitesh Arora
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
Patent number
8,900,919
Issue date
Dec 2, 2014
Intel Corporation
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dielectric film with low coefficient of thermal expansion (CTE) usi...
Patent number
8,901,716
Issue date
Dec 2, 2014
Intel Corporation
James C. Matayabas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermoset polyimides for microelectronic applications
Patent number
8,643,199
Issue date
Feb 4, 2014
Intel Corporation
Stephen E. Lehman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low coefficient of thermal expansion (CTE) thermosetting resins for...
Patent number
8,431,223
Issue date
Apr 30, 2013
Intel Corporation
James C. Matayabas
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Polymer solder hybrid interface material with improved solder fille...
Patent number
7,030,483
Issue date
Apr 18, 2006
Intel Corporation
James C Matayabas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polyamide nanocomposites with oxygen scavenging capability
Patent number
6,777,479
Issue date
Aug 17, 2004
Eastman Chemical Company
Linda Gail Bernard
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Process for preparing high barrier nanocomposites
Patent number
6,713,547
Issue date
Mar 30, 2004
University of South Carolina Research Foundation
Robert Boyd Barbee
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Polymer/clay nanocomposite comprising a clay mixture and a process...
Patent number
6,653,388
Issue date
Nov 25, 2003
University of South Carolina Research Foundation
Robert Boyd Barbee
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN...
Publication number
20210265238
Publication date
Aug 26, 2021
Intel Corporation
Marely E. Tejeda Ferrari
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING
Publication number
20210118809
Publication date
Apr 22, 2021
Intel Corporation
Li-Sheng Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
Publication number
20210101175
Publication date
Apr 8, 2021
Kyle Jordan Arrington
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP...
Publication number
20200350229
Publication date
Nov 5, 2020
Intel Corporation
Je-Young Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CARBON-PAD THERMAL-INTERFACE MATERIALS IN MULTI-DIE PACKAGES
Publication number
20200286809
Publication date
Sep 10, 2020
Intel Corporation
Shushan Gong
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
INTEGRATED HEAT SPREADER COMPRISING A SILVER AND SINTERING SILVER L...
Publication number
20200286806
Publication date
Sep 10, 2020
Intel Corporation
Elizabeth Nofen
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
Publication number
20200273811
Publication date
Aug 27, 2020
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20200227332
Publication date
Jul 16, 2020
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...
Publication number
20190267306
Publication date
Aug 29, 2019
Intel Corporation
Nachiket R. RARAVIKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
Publication number
20190099777
Publication date
Apr 4, 2019
Intel Corporation
Ken P. Hackenberg
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
Publication number
20190099776
Publication date
Apr 4, 2019
Ken P. Hackenberg
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information
Patent Application
COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES
Publication number
20190006259
Publication date
Jan 3, 2019
Intel Corporation
Dinesh Padmanabhan Ramalekshmi Thanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
Publication number
20180374776
Publication date
Dec 27, 2018
Intel Corporation
Boxi LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...
Publication number
20180323130
Publication date
Nov 8, 2018
Intel Corporation
Boxi LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
Publication number
20180286704
Publication date
Oct 4, 2018
Intel Corporation
Elizabeth M. Nofen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
Publication number
20180263117
Publication date
Sep 13, 2018
Intel Corporation
Sasha N. Oster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID LOW METAL LOADING FLUX
Publication number
20180236609
Publication date
Aug 23, 2018
Intel Corporation
Rajen S. SIDHU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...
Publication number
20180068926
Publication date
Mar 8, 2018
Intel Corporation
JAN KRAJNIAK
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS
Publication number
20180047693
Publication date
Feb 15, 2018
Intel Corporation
Nachiket R. RARAVIKAR
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Package Structure To Enhance Yield of TMI Interconnections
Publication number
20170207152
Publication date
Jul 20, 2017
Intel Corporation
Thomas J. De Bonis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACE TRANSFORMER WITH PERFORATED METALLIC PLATE FOR ELECTRICAL DIE...
Publication number
20170176518
Publication date
Jun 22, 2017
Nachiket R. Raravikar
G01 - MEASURING TESTING
Information
Patent Application
SPACE TRANSFORMER INCLUDING A PERFORATED MOLD PREFORM FOR ELECTRICA...
Publication number
20170176496
Publication date
Jun 22, 2017
Akshay Mathkar
G01 - MEASURING TESTING
Information
Patent Application
LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS
Publication number
20150279804
Publication date
Oct 1, 2015
Nachiket R. RARAVIKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POLYMER THERMAL INTERFACE MATERIAL HAVING ENHANCED THERMAL CONDUCTI...
Publication number
20150279762
Publication date
Oct 1, 2015
Intel Corporation
Randall LOWE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure To Enhance Yield of TMI Interconnections
Publication number
20150255415
Publication date
Sep 10, 2015
Thomas J. De Bonis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLED FLUID DELIVERY IN A MICROELECTRONIC PACKAGE
Publication number
20150209780
Publication date
Jul 30, 2015
Intel Corporation
Lakshmi Supriya
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
Publication number
20150166804
Publication date
Jun 18, 2015
Intel Corporation
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD
Publication number
20150163921
Publication date
Jun 11, 2015
Sasha Oster
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...
Publication number
20140264827
Publication date
Sep 18, 2014
Anna M. Prakash
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
Publication number
20140264957
Publication date
Sep 18, 2014
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...