James D. Legg

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for reducing plasma discharge damage during processing
- Patent number 8,343,842
- Issue date Jan 1, 2013
- FREESCALE SEMICONDUCTOR, INC.
- David M. Schraub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing plasma discharge damage during processing
- Patent number 7,951,695
- Issue date May 31, 2011
- FREESCALE SEMICONDUCTOR, INC.
- David M. Schraub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 7,323,094
- Issue date Jan 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 6,500,324
- Issue date Dec 31, 2002
- Motorola, Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material over a substrate
- Patent number 6,174,425
- Issue date Jan 16, 2001
- Motorola, Inc.
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Reducing Plasma Discharge Damage During Processing
- Publication number 20110179394
- Publication date Jul 21, 2011
- David M. Schraub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reducing Plasma Discharge Damage During Processing
- Publication number 20090291547
- Publication date Nov 26, 2009
- David M. Schraub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for depositing a layer of material on a substrate and a pla...
- Publication number 20020195347
- Publication date Dec 26, 2002
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR