James Denning Smith

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Corvallis, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Packaged MEMS device assembly
- Patent number 7,723,811
- Issue date May 25, 2010
- Hewlett-Packard Development Company, L.P.
- Charles C Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Packaged MEMS device assembly
- Publication number 20080272446
- Publication date Nov 6, 2008
- Charles C. Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY