James E. Fluegel

Person

Tivoli, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing introduction of foreign material to wafers
- Patent number 7,901,490
- Issue date Mar 8, 2011
- International Business Machines Corporation
- David J. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,407,605
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,253,106
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus with vertical electrical contact
- Patent number 6,627,052
- Issue date Sep 30, 2003
- International Business Machines Corporation
- James Edward Fluegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper seed layer repair technique using electroless touch-up
- Patent number 6,395,164
- Issue date May 28, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and method using a compressible contact
- Patent number 6,270,646
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Erick Gregory Walton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroplating a film onto a substrate
- Patent number 6,241,868
- Issue date Jun 5, 2001
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for making electrical contact to a substrate d...
- Patent number 6,077,405
- Issue date Jun 20, 2000
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
IC WAPER CARRIER SEALED FROM AMBIENT ATMOSPHERE DURING TRANSPORTATI...
- Publication number 20100051501
- Publication date Mar 4, 2010
- International Business Machines Corporation
- William E. Corbin, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS
- Publication number 20090180848
- Publication date Jul 16, 2009
- International Business Machines Corporation
- David J. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20070215842
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20060134911
- Publication date Jun 22, 2006
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming planar Cu interconnects without chemical mechanic...
- Publication number 20040094511
- Publication date May 20, 2004
- International Business Machines Corporation
- Soon-Cheon Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus with vertical electrical contact
- Publication number 20020108862
- Publication date Aug 15, 2002
- James Edward Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

James E. Fluegel

Person

Patents Grantslast 30 patents

Reducing introduction of foreign material to wafers

Void-free damascene copper deposition process and means of monitori...

Manufacturable CoWP metal cap process for copper interconnects

Manufacturable CoWP metal cap process for copper interconnects

Electroplated copper interconnection structure, process for making...

Electroplating apparatus with vertical electrical contact

Method of controlling chemical bath composition in a manufacturing...

Copper seed layer repair technique using electroless touch-up

Electroplating apparatus and method using a compressible contact

Method for electroplating a film onto a substrate

Method and apparatus for making electrical contact to a substrate d...

Patents Applicationslast 30 patents

IC WAPER CARRIER SEALED FROM AMBIENT ATMOSPHERE DURING TRANSPORTATI...

REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Void-free damascene copper deposition process and means of monitori...

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Method of forming planar Cu interconnects without chemical mechanic...

Electroplating apparatus with vertical electrical contact