JAMES E. HISERT

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Utica, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermally decomposing build plate for facile release of 3D printed...
- Patent number 11,766,721
- Issue date Sep 26, 2023
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device assembly having a thermal interface bond betwe...
- Patent number 10,943,796
- Issue date Mar 9, 2021
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for creating a thermal interface bond between...
- Patent number 10,943,795
- Issue date Mar 9, 2021
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly including a thermal interface bond be...
- Patent number 10,607,857
- Issue date Mar 31, 2020
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED...
- Publication number 20210053122
- Publication date Feb 25, 2021
- Indium Corporation
- David P. Socha
- B22 - CASTING POWDER METALLURGY
Information Patent Application
APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...
- Publication number 20200126813
- Publication date Apr 23, 2020
- Indium Corporation
- ROSS B. BERNTSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...
- Publication number 20190172727
- Publication date Jun 6, 2019
- Indium Corporation
- ROSS B. BERNTSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CREATING A THERMAL INTERFACE BOND BETWEEN...
- Publication number 20190172726
- Publication date Jun 6, 2019
- Indium Corporation
- ROSS B. BERNTSON
- H01 - BASIC ELECTRIC ELEMENTS