James Edward Neeb

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Debug tool for test instruments coupled to a device under test
- Patent number 11,598,804
- Issue date Mar 7, 2023
- Intel Corporation
- Jesse Armagost
- G01 - MEASURING TESTING
Information Patent Grant
Compressed test patterns for a field programmable gate array
- Patent number 11,193,975
- Issue date Dec 7, 2021
- Intel Corportion
- Christopher J. Nelson
- G01 - MEASURING TESTING
Information Patent Grant
Bus for communication between devices
- Patent number 9,886,401
- Issue date Feb 6, 2018
- Intel Corporation
- James Neeb
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit test temperature control mechanism
- Patent number 9,869,714
- Issue date Jan 16, 2018
- Intel Corporation
- John C. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Asynchronous communication between devices
- Patent number 9,454,499
- Issue date Sep 27, 2016
- Intel Corporation
- James Neeb
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit test temperature control mechanism
- Patent number 9,400,291
- Issue date Jul 26, 2016
- Intel Corporation
- John C. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly with decoupling capacitors
- Patent number 6,898,852
- Issue date May 31, 2005
- Intel Corporation
- Nader N. Abazarnia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for testing semiconductor devices
- Patent number 6,894,523
- Issue date May 17, 2005
- Intel Corporation
- Jim Neeb
- G01 - MEASURING TESTING
Information Patent Grant
Joint test action group (JTAG) tester, such as to test integrated c...
- Patent number 6,766,486
- Issue date Jul 20, 2004
- Intel Corporation
- James E. Neeb
- G01 - MEASURING TESTING
Information Patent Grant
Connector assembly with decoupling capacitors
- Patent number 6,621,287
- Issue date Sep 16, 2003
- Intel Corporation
- Nader N. Abazarnia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for power continuity testing in a parallel tes...
- Patent number 6,559,673
- Issue date May 6, 2003
- Intel Corporation
- James E. Neeb
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus and method for power continuity testing in a parallel tes...
- Patent number 6,441,637
- Issue date Aug 27, 2002
- Intel Corporation
- James E. Neeb
- G01 - MEASURING TESTING
Information Patent Grant
Directed self-heating for reduction of system test time
- Patent number 6,163,161
- Issue date Dec 19, 2000
- Intel Corporation
- James Edward Neeb
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR A VACUUM COMPATIBLE ELECTRICAL INTERFACE, ENA...
- Publication number 20240219452
- Publication date Jul 4, 2024
- Intel Corporation
- Prasoon JOSHI
- G01 - MEASURING TESTING
Information Patent Application
DEBUG TOOL FOR TEST INSTRUMENTS COUPLED TO A DEVICE UNDER TEST
- Publication number 20200300912
- Publication date Sep 24, 2020
- Intel Corporation
- Jesse ARMAGOST
- G01 - MEASURING TESTING
Information Patent Application
COMPRESSED TEST PATTERNS FOR A FIELD PROGRAMMABLE GATE ARRAY
- Publication number 20200003836
- Publication date Jan 2, 2020
- Intel Corporation
- Christopher J. NELSON
- G01 - MEASURING TESTING
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR COMMUNICATION BETWEEN DEVICES
- Publication number 20170103028
- Publication date Apr 13, 2017
- Intel Corporation
- James Neeb
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE TESTER WITH DUT DATA STREAMING
- Publication number 20160313370
- Publication date Oct 27, 2016
- Intel Corporation
- James Neeb
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT TEST TEMPERATURE CONTROL MECHANISM
- Publication number 20160291083
- Publication date Oct 6, 2016
- Intel Corporation
- John C. Johnson
- G01 - MEASURING TESTING
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR COMMUNICATION BETWEEN DEVICES
- Publication number 20140365832
- Publication date Dec 11, 2014
- James Neeb
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Test Temperature Control Mechanism
- Publication number 20140062513
- Publication date Mar 6, 2014
- John C. Johnson
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor test system and method
- Publication number 20050001647
- Publication date Jan 6, 2005
- Jim Neeb
- G01 - MEASURING TESTING
Information Patent Application
Connector assembly with decoupling capacitors
- Publication number 20020171443
- Publication date Nov 21, 2002
- Intel Corporation
- Nader N. Abazarnia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for power continuity testing in a parallel tes...
- Publication number 20020158656
- Publication date Oct 31, 2002
- James E. Neeb
- G01 - MEASURING TESTING
Information Patent Application
Joint test action group (JTAG) tester, such as to test integrated c...
- Publication number 20020069386
- Publication date Jun 6, 2002
- James E. Neeb
- G01 - MEASURING TESTING

James Edward Neeb

Person

Patents Grantslast 30 patents

Debug tool for test instruments coupled to a device under test

Compressed test patterns for a field programmable gate array

Bus for communication between devices

Integrated circuit test temperature control mechanism

Reduced expansion thermal compression bonding process bond head

Asynchronous communication between devices

Integrated circuit test temperature control mechanism

Connector assembly with decoupling capacitors

System and method for testing semiconductor devices

Joint test action group (JTAG) tester, such as to test integrated c...

Connector assembly with decoupling capacitors

Apparatus and method for power continuity testing in a parallel tes...

Apparatus and method for power continuity testing in a parallel tes...

Directed self-heating for reduction of system test time

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR A VACUUM COMPATIBLE ELECTRICAL INTERFACE, ENA...

DEBUG TOOL FOR TEST INSTRUMENTS COUPLED TO A DEVICE UNDER TEST

COMPRESSED TEST PATTERNS FOR A FIELD PROGRAMMABLE GATE ARRAY

TECHNIQUES AND CONFIGURATIONS FOR COMMUNICATION BETWEEN DEVICES

SEMICONDUCTOR DEVICE TESTER WITH DUT DATA STREAMING

INTEGRATED CIRCUIT TEST TEMPERATURE CONTROL MECHANISM

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

TECHNIQUES AND CONFIGURATIONS FOR COMMUNICATION BETWEEN DEVICES

Integrated Circuit Test Temperature Control Mechanism

Semiconductor test system and method

Connector assembly with decoupling capacitors

Apparatus and method for power continuity testing in a parallel tes...

Joint test action group (JTAG) tester, such as to test integrated c...