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James Fiore
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Essex Junction, VT, US
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last 30 patents
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Patent Grant
Chip design process for wire bond and flip-chip package
Patent number
6,204,074
Issue date
Mar 20, 2001
International Business Machines Corporation
Allan Bertolet
G01 - MEASURING TESTING
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Patent Grant
Consolidated chip design for wire bond and flip-chip package techno...
Patent number
5,844,317
Issue date
Dec 1, 1998
International Business Machines Corporation
Allan Bertolet
G01 - MEASURING TESTING