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James G. MAVEETY
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Campbell, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit test temperature control mechanism
Patent number
9,869,714
Issue date
Jan 16, 2018
Intel Corporation
John C. Johnson
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication of stacked die and structures formed thereby
Patent number
9,466,595
Issue date
Oct 11, 2016
Intel Corporation
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
Patent number
9,448,278
Issue date
Sep 20, 2016
Intel Corporation
Christopher R. Schroeder
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Apparatus to minimize thermal impedance using copper on die backside
Patent number
9,406,582
Issue date
Aug 2, 2016
Intel Corporation
Fay Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit test temperature control mechanism
Patent number
9,400,291
Issue date
Jul 26, 2016
Intel Corporation
John C. Johnson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
Patent number
9,347,987
Issue date
May 24, 2016
Intel Corporation
Christopher R. Schroeder
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
Patent number
9,207,274
Issue date
Dec 8, 2015
Intel Corporation
Christopher R. Schroeder
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Seal method for direct liquid cooling of probes used at first level...
Patent number
9,046,569
Issue date
Jun 2, 2015
Intel Corporation
Ronald Kirby
G01 - MEASURING TESTING
Information
Patent Grant
Thermal interface for multi-chip packages
Patent number
8,891,235
Issue date
Nov 18, 2014
Intel Corporation
Joseph F. Walczyk
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Nanotube based vapor chamber for die level cooling
Patent number
8,623,705
Issue date
Jan 7, 2014
Intel Corporation
Unnikrishnan Vadakkanmaruveedu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die having a via filled with a heat-dissipating material
Patent number
8,505,613
Issue date
Aug 13, 2013
Intel Corporation
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Process that includes assembling together first and second substrat...
Patent number
8,404,519
Issue date
Mar 26, 2013
Intel Corporation
Gregory M. Chrysler
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Carbon nanotube micro-chimney and thermo siphon die-level cooling
Patent number
8,125,075
Issue date
Feb 28, 2012
Intel Corporation
James G. Maveety
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Micro-chimney and thermosiphon die-level cooling
Patent number
8,006,747
Issue date
Aug 30, 2011
Intel Corporation
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Process of making carbon nanotube array that includes impregnating...
Patent number
7,964,447
Issue date
Jun 21, 2011
Intel Corporation
Gregory M. Chrysler
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Nanotube based vapor chamber for die level cooling
Patent number
7,911,052
Issue date
Mar 22, 2011
Intel Corporation
Unnikrishnan Vadakkanmaruveedu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal interface material with carbon nanotubes and particles
Patent number
7,886,813
Issue date
Feb 15, 2011
Intel Corporation
Fay Hua
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Integrated re-combiner for electroosmotic pumps using porous frits
Patent number
7,723,208
Issue date
May 25, 2010
Intel Corporation
Sarah E. Kim
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information
Patent Grant
Method of forming a stack of heat generating integrated circuit chi...
Patent number
7,696,015
Issue date
Apr 13, 2010
Intel Corporation
Sarah E. Kim
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information
Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
Patent number
7,576,432
Issue date
Aug 18, 2009
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Article having metal impregnated within carbon nanotube array
Patent number
7,545,030
Issue date
Jun 9, 2009
Intel Corporation
Gregory M. Chrysler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diamond-silicon hybrid integrated heat spreader
Patent number
7,492,041
Issue date
Feb 17, 2009
Intel Corporation
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-chimney and thermosiphon die-level cooling
Patent number
7,487,822
Issue date
Feb 10, 2009
Intel Corporation
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Apparatus to minimize thermal impedance using copper on die backside
Patent number
7,449,780
Issue date
Nov 11, 2008
Intel Corporation
Fay Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming carbon nanotube capacitors
Patent number
7,428,138
Issue date
Sep 23, 2008
Intel Corporation
Larry E. Mosley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carbon nanotube interconnects in porous diamond interlayer dielectrics
Patent number
7,365,003
Issue date
Apr 29, 2008
Intel Corporation
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carbon nanotube micro-chimney and thermo siphon die-level cooling
Patent number
7,335,983
Issue date
Feb 26, 2008
Intel Corporation
James G. Maveety
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged electroosmotic pumps using porous frits for cooling integr...
Patent number
7,274,106
Issue date
Sep 25, 2007
Intel Corporation
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroosmotic pumps using porous frits for cooling integrated circ...
Patent number
7,084,495
Issue date
Aug 1, 2006
Intel Corporation
Sarah E. Kim
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information
Patent Grant
Micro-impeller miniature centrifugal compressor
Patent number
7,021,891
Issue date
Apr 4, 2006
Intel Corporation
Eduardo A. Sanchez
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT TEST TEMPERATURE CONTROL MECHANISM
Publication number
20160291083
Publication date
Oct 6, 2016
Intel Corporation
John C. Johnson
G01 - MEASURING TESTING
Information
Patent Application
DIRECT LIQUID-CONTACT MICRO-CHANNEL HEAT TRANSFER DEVICES, METHODS...
Publication number
20150285857
Publication date
Oct 8, 2015
Intel Corporation
Christopher R. SCHROEDER
G01 - MEASURING TESTING
Information
Patent Application
SEAL METHOD FOR DIRECT LIQUID COOLING OF PROBES USED AT FIRST LEVEL...
Publication number
20140125367
Publication date
May 8, 2014
Ronald Kirby
G01 - MEASURING TESTING
Information
Patent Application
Integrated Circuit Test Temperature Control Mechanism
Publication number
20140062513
Publication date
Mar 6, 2014
John C. Johnson
G01 - MEASURING TESTING
Information
Patent Application
THERMAL INTERFACE FOR MULTI-CHIP PACKAGES
Publication number
20140002994
Publication date
Jan 2, 2014
Joseph F. Walczyk
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
CARBON NANOTUBE MICRO-CHIMNEY AND THERMO SIPHON DIE-LEVEL COOLING
Publication number
20120021566
Publication date
Jan 26, 2012
James G. Maveety
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING
Publication number
20110297362
Publication date
Dec 8, 2011
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING
Publication number
20110269271
Publication date
Nov 3, 2011
Unnikrishnan Vadakkanmaruveedu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MA...
Publication number
20110214285
Publication date
Sep 8, 2011
Gregory M. Chrysler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Direct liquid-contact micro-channel heat transfer devices, methods...
Publication number
20110109335
Publication date
May 12, 2011
Christopher R. Schroeder
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Carbon nanotube and metal thermal interface material, process of ma...
Publication number
20090218681
Publication date
Sep 3, 2009
Gregory M. Chrysler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Micro-chimney and thermosiphon die-level cooling
Publication number
20090129022
Publication date
May 21, 2009
Intel Corporation
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING
Publication number
20090085198
Publication date
Apr 2, 2009
Unnikrishnan Vadakkanmaruveedu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming carbon nanotube capacitors
Publication number
20080305603
Publication date
Dec 11, 2008
Larry E. Mosley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE
Publication number
20080296754
Publication date
Dec 4, 2008
Intel Corporation
Fay Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Compliant conductive interconnects
Publication number
20070297151
Publication date
Dec 27, 2007
Larry E. Mosley
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Packaged electroosmotic pumps using porous frits for cooling integr...
Publication number
20070278668
Publication date
Dec 6, 2007
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Forming carbon nanotube capacitors
Publication number
20070242417
Publication date
Oct 18, 2007
Larry E. Mosley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carbon nanotube and metal thermal interface material, process of ma...
Publication number
20070155136
Publication date
Jul 5, 2007
Intel Corporation
Gregory M. Chrysler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carbon nanotube micro-chimney and thermo siphon die-level cooling
Publication number
20070138623
Publication date
Jun 21, 2007
Intel Corporation
James G. Maveety
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermal interface material and method
Publication number
20070001310
Publication date
Jan 4, 2007
Fay Hua
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
Publication number
20060226541
Publication date
Oct 12, 2006
Sarah E. Kim
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information
Patent Application
Carbon nanotube interconnects in porous diamond interlayer dielectrics
Publication number
20060138658
Publication date
Jun 29, 2006
Kramadhati V. Ravi
B82 - NANO-TECHNOLOGY
Information
Patent Application
Fabrication of stacked die and structures formed thereby
Publication number
20060128061
Publication date
Jun 15, 2006
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication of stacked die and structures formed thereby
Publication number
20060073636
Publication date
Apr 6, 2006
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
Publication number
20060055030
Publication date
Mar 16, 2006
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Micro-chimney and thermosiphon die-level cooling
Publication number
20060032608
Publication date
Feb 16, 2006
Intel Corporation
Gregory M. Chrysler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Diamond-silicon hybrid integrated heat spreader
Publication number
20050179126
Publication date
Aug 18, 2005
Intel Corporation
Kramadhati V. Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
Publication number
20050093138
Publication date
May 5, 2005
Sarah E. Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
Publication number
20050085018
Publication date
Apr 21, 2005
Sarah E. Kim
F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...