James G. McMullen

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Pattersonville, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Direct thermocompression bonding for thin electronic power chips
- Patent number 5,304,847
- Issue date Apr 19, 1994
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor electrical contacts using metal fo...
- Patent number 5,206,186
- Issue date Apr 27, 1993
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct thermocompression bonding for thin electronic power chips
- Patent number 5,184,206
- Issue date Feb 2, 1993
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing via holes in polymer dielectrics
- Patent number 4,764,485
- Issue date Aug 16, 1988
- General Electric Company
- James A. Loughran
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL