James G. Mitchell

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating multi-chip module with multi-level interposer
- Patent number 9,281,268
- Issue date Mar 8, 2016
- Oracle International Corporation
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip package with reinforced positive alignment features
- Patent number 8,659,161
- Issue date Feb 25, 2014
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High-bandwidth ramp-stack chip package
- Patent number 8,476,749
- Issue date Jul 2, 2013
- Oracle America, Inc.
- Robert J. Drost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module with multi-level interposer
- Patent number 8,218,334
- Issue date Jul 10, 2012
- Oracle America, Inc.
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-assembly of micro-structures
- Patent number 8,076,178
- Issue date Dec 13, 2011
- Oracle America, Inc.
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated-circuit package for proximity communication
- Patent number 8,039,308
- Issue date Oct 18, 2011
- Oracle America, Inc.
- James G. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip system including capacitively coupled and optical commun...
- Patent number 7,961,990
- Issue date Jun 14, 2011
- Oracle America, Inc.
- Ashok V. Krishnamoorthy
- G02 - OPTICS
Information Patent Grant
Alignment features for proximity communication
- Patent number 7,923,845
- Issue date Apr 12, 2011
- Oracle America, Inc.
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated-circuit package for proximity communication
- Patent number 7,893,531
- Issue date Feb 22, 2011
- Oracle America, Inc.
- James G. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for subcontracts in distributed processing sys...
- Patent number 5,787,251
- Issue date Jul 28, 1998
- Sun Microsystems, Inc.
- Graham Hamilton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Object oriented system for executing application call by using plur...
- Patent number 5,577,251
- Issue date Nov 19, 1996
- Sun Microsystems, Inc.
- Graham Hamilton
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES
- Publication number 20120326322
- Publication date Dec 27, 2012
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20120266464
- Publication date Oct 25, 2012
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY OF MICRO-STRUCTURES
- Publication number 20110281395
- Publication date Nov 17, 2011
- SUN MICROSYSTEMS, INC.
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20110223778
- Publication date Sep 15, 2011
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION
- Publication number 20110111559
- Publication date May 12, 2011
- Oracle International Corporation
- James G. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH RAMP-STACK CHIP PACKAGE
- Publication number 20110018120
- Publication date Jan 27, 2011
- SUN MICROSYSTEMS, INC.
- Robert J. Drost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUN...
- Publication number 20100266240
- Publication date Oct 21, 2010
- SUN MICROSYSTEMS, INC.
- Ashok V. Krishnamoorthy
- G02 - OPTICS
Information Patent Application
ALIGNMENT FEATURES FOR PROXIMITY COMMUNICATION
- Publication number 20090085233
- Publication date Apr 2, 2009
- SUN MICROSYSTEMS, INC.
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION
- Publication number 20090085183
- Publication date Apr 2, 2009
- SUN MICROSYSTEMS, INC.
- James G. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS

James G. Mitchell

Person

Patents Grantslast 30 patents

Method for fabricating multi-chip module with multi-level interposer

Chip package with reinforced positive alignment features

High-bandwidth ramp-stack chip package

Multi-chip module with multi-level interposer

Self-assembly of micro-structures

Integrated-circuit package for proximity communication

Multi-chip system including capacitively coupled and optical commun...

Alignment features for proximity communication

Integrated-circuit package for proximity communication

Method and apparatus for subcontracts in distributed processing sys...

Object oriented system for executing application call by using plur...

Patents Applicationslast 30 patents

CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

SELF-ASSEMBLY OF MICRO-STRUCTURES

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION

HIGH-BANDWIDTH RAMP-STACK CHIP PACKAGE

MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUN...

ALIGNMENT FEATURES FOR PROXIMITY COMMUNICATION

INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION