James Golden

Person

Afton, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for packaging, handling or testing of sensors
- Patent number 10,935,569
- Issue date Mar 2, 2021
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for packaging, handling or testing of sensors
- Patent number 10,782,315
- Issue date Sep 22, 2020
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optimized epoxy die attach geometry for MEMS die
- Patent number 10,065,853
- Issue date Sep 4, 2018
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attach stress isolation
- Patent number 8,803,262
- Issue date Aug 12, 2014
- Rosemount Aerospace Inc.
- Marcus A. Childress
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of electrical testing of an integrated circuit with an elect...
- Patent number 7,239,160
- Issue date Jul 3, 2007
- Agere Systems Inc.
- James Golden
- G01 - MEASURING TESTING
Information Patent Grant
Method of electrical testing
- Patent number 7,132,840
- Issue date Nov 7, 2006
- Agere Systems Inc.
- James Golden
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE TRANSDUCER INCLUDING KOVAR INTEGRATED PACKAGES
- Publication number 20200355568
- Publication date Nov 12, 2020
- Rosemount Aerospace Inc.
- Jim Golden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS
- Publication number 20190154729
- Publication date May 23, 2019
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS
- Publication number 20180299482
- Publication date Oct 18, 2018
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTIMIZED EPOXY DIE ATTACH GEOMETRY FOR MEMS DIE
- Publication number 20170334713
- Publication date Nov 23, 2017
- Rosemount Aerospace Inc.
- Jim Golden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACH STRESS ISOLATION
- Publication number 20130181303
- Publication date Jul 18, 2013
- Rosemount Aerospace Inc.
- Marcus A. Childress
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of electrical testing
- Publication number 20070024303
- Publication date Feb 1, 2007
- James Golden
- G01 - MEASURING TESTING
Information Patent Application
Method of electrical testing
- Publication number 20060022689
- Publication date Feb 2, 2006
- James Golden
- G01 - MEASURING TESTING

James Golden

Person

Patents Grantslast 30 patents

Apparatus and method for packaging, handling or testing of sensors

Apparatus and method for packaging, handling or testing of sensors

Optimized epoxy die attach geometry for MEMS die

Die attach stress isolation

Method of electrical testing of an integrated circuit with an elect...

Method of electrical testing

Patents Applicationslast 30 patents

PRESSURE TRANSDUCER INCLUDING KOVAR INTEGRATED PACKAGES

APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS

APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS

OPTIMIZED EPOXY DIE ATTACH GEOMETRY FOR MEMS DIE

DIE ATTACH STRESS ISOLATION

Method of electrical testing

Method of electrical testing