James H. Covell

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tactile surface inspection during device fabrication or assembly
- Patent number 7,989,229
- Issue date Aug 2, 2011
- International Business Machines Corporation
- James H. Covell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing known good die
- Patent number 7,806,312
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Lannie R Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for removing known good die
- Patent number 7,168,609
- Issue date Jan 30, 2007
- International Business Machines Corporation
- Lannie R Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
One step method for curing and joining BGA solder balls
- Patent number 6,333,209
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensing method to place flip chips
- Patent number 6,278,193
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder column attach by injection molded solder and...
- Patent number 6,276,596
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cast metal seal for semiconductor substrates
- Patent number 5,982,038
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Hilton T. Toy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for continuous casting solder onto discrete parts
- Patent number 5,971,058
- Issue date Oct 26, 1999
- International Business Machines Corporation
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of a multi-component solder column by blockin...
- Patent number 5,961,032
- Issue date Oct 5, 1999
- International Business Machines Corporation
- James H. Covell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cast metal seal for semiconductor substrates and process thereof
- Patent number 5,821,161
- Issue date Oct 13, 1998
- International Business Machines Corporation
- James H. Covell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming mold for metallic material
- Patent number 5,718,361
- Issue date Feb 17, 1998
- International Business Machines Corporation
- Carol Jill Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold transfer apparatus and method
- Patent number 5,718,367
- Issue date Feb 17, 1998
- International Business Machines Corporation
- James Howard Covell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TACTILE SURFACE INSPECTION DURING DEVICE FABRICATION OR ASSEMBLY
- Publication number 20090068770
- Publication date Mar 12, 2009
- International Business Machines Corporation
- James H. Covell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE
- Publication number 20070057024
- Publication date Mar 15, 2007
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for removing known good die
- Publication number 20040041011
- Publication date Mar 4, 2004
- International Business Machines Corporation
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature solder column attach by injection molded solder and...
- Publication number 20020023945
- Publication date Feb 28, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS

James H. Covell

Person

Patents Grantslast 30 patents

Tactile surface inspection during device fabrication or assembly

Method and apparatus for removing known good die

Method and apparatus for removing known good die

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

One step method for curing and joining BGA solder balls

Optical sensing method to place flip chips

Low temperature solder column attach by injection molded solder and...

Cast metal seal for semiconductor substrates

Apparatus and method for continuous casting solder onto discrete parts

Enhanced ceramic ball grid array using in-situ solder stretch with...

Method of fabrication of a multi-component solder column by blockin...

Cast metal seal for semiconductor substrates and process thereof

Apparatus and method for forming mold for metallic material

Mold transfer apparatus and method

Patents Applicationslast 30 patents

TACTILE SURFACE INSPECTION DURING DEVICE FABRICATION OR ASSEMBLY

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

Stress resistant land grid array (LGA) module and method of forming...

Method and apparatus for removing known good die

Stress resistant land grid array (LGA) module and method of forming...

Low temperature solder column attach by injection molded solder and...