James H. Kleffner

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Leander, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Digital and RF system and method therefor
- Patent number 7,479,407
- Issue date Jan 20, 2009
- FREESCALE SEMICONDUCTOR, INC.
- John Gehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple sides having package contacts
- Patent number 6,815,254
- Issue date Nov 9, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stress relief in solder bump formation on...
- Patent number 6,077,726
- Issue date Jun 20, 2000
- Motorola, Inc.
- Addi Burjorji Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped semiconductor device having a trench for stress relief
- Patent number 5,943,597
- Issue date Aug 24, 1999
- Motorola, Inc.
- James H. Kleffner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Digital and RF system and method therefor
- Publication number 20040195591
- Publication date Oct 7, 2004
- John Gehman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with multiple sides having package contacts
- Publication number 20040178499
- Publication date Sep 16, 2004
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS