James J. Kelly

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bridge chip with through via
- Patent number 11,848,273
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal via structure
- Patent number 11,784,120
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual redistribution layer structure
- Patent number 11,315,831
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration structure and planar joining
- Patent number 11,282,716
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid TIMs for electronic package cooling
- Patent number 11,264,306
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement metal cap by an exchange reaction
- Patent number 11,251,126
- Issue date Feb 15, 2022
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu—Cu bonding for interconnects on bridge chip attached to chips an...
- Patent number 11,239,167
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous plating of varying size features on semiconductor subs...
- Patent number 11,171,006
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal via structure
- Patent number 11,152,298
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controllable formation of recessed bottom electrode contact in a me...
- Patent number 11,133,457
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double metal patterning
- Patent number 11,069,564
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact isolation for semiconductor structures
- Patent number 11,063,126
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having trenches with varied dimensions for mult...
- Patent number 11,049,844
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with self-forming wrap-all-around barrier layer
- Patent number 10,978,342
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack viabar structures
- Patent number 10,971,356
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar wafer level fan-out of multi-chip modules having different s...
- Patent number 10,943,883
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structure
- Patent number 10,910,307
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,903,116
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structure
- Patent number 10,903,161
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress modulation of nFET and pFET fin structures
- Patent number 10,832,973
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer self aligned multi-patterning integration
- Patent number 10,825,726
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spacer self aligned double patterning with airgap integration
- Patent number 10,811,310
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method using metal spacer for insertion of variable w...
- Patent number 10,714,389
- Issue date Jul 14, 2020
- ELPIS TECHNOLOGIES, INC.
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress modulation of nFET and pFET fin structures
- Patent number 10,665,512
- Issue date May 26, 2020
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement metal cap by an exchange reaction
- Patent number 10,651,125
- Issue date May 12, 2020
- International Business Machines Corporation
- James J. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack viabar structures
- Patent number 10,615,027
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free metallic interconnect structures with self-formed diffusi...
- Patent number 10,529,622
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fully aligned via employing selective metal deposition
- Patent number 10,395,986
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enlarged contact area structure using noble metal cap and noble met...
- Patent number 10,361,119
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
- Publication number 20250046654
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE
- Publication number 20240387426
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
- Publication number 20230268275
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridge Chip with Through Via
- Publication number 20230154854
- Publication date May 18, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL REDISTRIBUTION LAYER STRUCTURE
- Publication number 20220246472
- Publication date Aug 4, 2022
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL VIA STRUCTURE
- Publication number 20220005762
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...
- Publication number 20210175174
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simultaneous Plating of Varying Size Features on Semiconductor Subs...
- Publication number 20210175084
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATION STRUCTURE AND PLANAR JOINING
- Publication number 20210143022
- Publication date May 13, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
- Publication number 20210098334
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...
- Publication number 20210091032
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLABLE FORMATION OF RECESSED BOTTOM ELECTRODE CONTACT IN A ME...
- Publication number 20210091303
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Raghuveer PATLOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL REDISTRIBUTION LAYER STRUCTURE
- Publication number 20210028061
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...
- Publication number 20210005573
- Publication date Jan 7, 2021
- International Business Machines Corporation
- Ravi K. Bonam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL VIA STRUCTURE
- Publication number 20200388567
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE METAL PATTERNING
- Publication number 20200328111
- Publication date Oct 15, 2020
- International Business Machines Corporation
- HSUEH-CHUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CONTACT ISOLATION FOR SEMICONDUCTOR STRUCTURES
- Publication number 20200279925
- Publication date Sep 3, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATION OF NFET AND PFET FIN STRUCTURES
- Publication number 20200266111
- Publication date Aug 20, 2020
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect with Self-Forming Wrap-All-Around Barrier Layer
- Publication number 20200243383
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT METAL CAP BY AN EXCHANGE REACTION
- Publication number 20200219817
- Publication date Jul 9, 2020
- International Business Machines Corporation
- James J. KELLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK VIABAR STRUCTURES
- Publication number 20200203156
- Publication date Jun 25, 2020
- International Business Machines Corporation
- Su Chen FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURE
- Publication number 20200144178
- Publication date May 7, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURE
- Publication number 20200144180
- Publication date May 7, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METAL SPACER SELF ALIGNED DOUBLE PATTERNING WITH AIRGAP INTEGRATION
- Publication number 20200135537
- Publication date Apr 30, 2020
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK VIABAR STRUCTURES
- Publication number 20200135457
- Publication date Apr 30, 2020
- International Business Machines Corporation
- Su Chen FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MODULATION OF NFET AND PFET FIN STRUCTURES
- Publication number 20200126867
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SPACER SELF ALIGNED MULTI-PATTERNING INTEGRATION
- Publication number 20200118872
- Publication date Apr 16, 2020
- International Business Machines Corporation
- HSUEH-CHUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT METAL CAP BY AN EXCHANGE REACTION
- Publication number 20200058593
- Publication date Feb 20, 2020
- International Business Machines Corporation
- James J. KELLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...
- Publication number 20200020577
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS

James J. Kelly

Person

Patents Grantslast 30 patents

Bridge chip with through via

Metal via structure

Protective surface layer on under bump metallurgy for solder joining

Dual redistribution layer structure

Integration structure and planar joining

Hybrid TIMs for electronic package cooling

Replacement metal cap by an exchange reaction

Cu—Cu bonding for interconnects on bridge chip attached to chips an...

Simultaneous plating of varying size features on semiconductor subs...

Metal via structure

Controllable formation of recessed bottom electrode contact in a me...

Double metal patterning

Metal contact isolation for semiconductor structures

Semiconductor wafer having trenches with varied dimensions for mult...

Interconnect with self-forming wrap-all-around barrier layer

Stack viabar structures

Planar wafer level fan-out of multi-chip modules having different s...

Back end of line metallization structure

Void-free metallic interconnect structures with self-formed diffusi...

Back end of line metallization structure

Stress modulation of nFET and pFET fin structures

Metal spacer self aligned multi-patterning integration

Metal spacer self aligned double patterning with airgap integration

Structure and method using metal spacer for insertion of variable w...

Stress modulation of nFET and pFET fin structures

Replacement metal cap by an exchange reaction

Stack viabar structures

Void-free metallic interconnect structures with self-formed diffusi...

Fully aligned via employing selective metal deposition

Enlarged contact area structure using noble metal cap and noble met...

Patents Applicationslast 30 patents

DIFFERENTIAL ETCH RATES OF COPPER FEATURES

ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE

RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER

Bridge Chip with Through Via

DUAL REDISTRIBUTION LAYER STRUCTURE

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

METAL VIA STRUCTURE

Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...

Simultaneous Plating of Varying Size Features on Semiconductor Subs...

INTEGRATION STRUCTURE AND PLANAR JOINING

HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING

PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT S...

CONTROLLABLE FORMATION OF RECESSED BOTTOM ELECTRODE CONTACT IN A ME...

DUAL REDISTRIBUTION LAYER STRUCTURE

SEMICONDUCTOR WAFER HAVING TRENCHES WITH VARIED DIMENSIONS FOR MULT...

METAL VIA STRUCTURE

DOUBLE METAL PATTERNING

METAL CONTACT ISOLATION FOR SEMICONDUCTOR STRUCTURES

STRESS MODULATION OF NFET AND PFET FIN STRUCTURES

Interconnect with Self-Forming Wrap-All-Around Barrier Layer

REPLACEMENT METAL CAP BY AN EXCHANGE REACTION

STACK VIABAR STRUCTURES

BACK END OF LINE METALLIZATION STRUCTURE

BACK END OF LINE METALLIZATION STRUCTURE

METAL SPACER SELF ALIGNED DOUBLE PATTERNING WITH AIRGAP INTEGRATION

STACK VIABAR STRUCTURES

STRESS MODULATION OF NFET AND PFET FIN STRUCTURES

METAL SPACER SELF ALIGNED MULTI-PATTERNING INTEGRATION

REPLACEMENT METAL CAP BY AN EXCHANGE REACTION

VOID-FREE METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMED DIFFUSI...