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James J. McNamara, Jr.
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Vestal, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Circuitized substrate with dielectric interposer assembly and method
Patent number
8,299,371
Issue date
Oct 30, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Anti-tamper microchip package based on thermal nanofluids or fluids
Patent number
8,288,857
Issue date
Oct 16, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making circuitized substrates having photo-imageable die...
Patent number
7,977,034
Issue date
Jul 12, 2011
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for making circuitized substrates having photo-imageable...
Patent number
7,827,682
Issue date
Nov 9, 2010
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Item identification control method
Patent number
7,801,833
Issue date
Sep 21, 2010
Endicott Interconnect Technologies, Inc.
Ashwinkumar Bhatt
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for making a multilayered circuitized substrate
Patent number
7,627,947
Issue date
Dec 8, 2009
Endicott Interconnect Technologies, Inc.
Thomas J. Davis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making a printed circuit board with low cross-talk noise
Patent number
7,530,167
Issue date
May 12, 2009
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of inspecting articles using imaging inspection apparatus wi...
Patent number
7,510,324
Issue date
Mar 31, 2009
Endicott Interconnect Technologies, Inc.
Ashwinkumar C. Bhatt
G01 - MEASURING TESTING
Information
Patent Grant
Method of making an imaging inspection apparatus with improved cooling
Patent number
7,490,984
Issue date
Feb 17, 2009
Endicott Interconnect Technologies, Inc.
Ashwinkumar C. Bhatt
G01 - MEASURING TESTING
Information
Patent Grant
Imaging inspection apparatus with improved cooling
Patent number
7,354,197
Issue date
Apr 8, 2008
Endicott Interconnect Technologies, Inc.
Ashwinkumar C. Bhatt
G01 - MEASURING TESTING
Information
Patent Grant
Imaging inspection apparatus with directional cooling
Patent number
7,261,466
Issue date
Aug 28, 2007
Endicott Interconnect Technologies, Inc.
Ashwinkumar C. Bhatt
G01 - MEASURING TESTING
Information
Patent Grant
Printed circuit board with low cross-talk noise
Patent number
7,176,383
Issue date
Feb 13, 2007
Endicott Interconnect Technologies, Inc.
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME
Publication number
20120201006
Publication date
Aug 9, 2012
Endicott Interconnect Technologies, Inc.
Voya R. Markovich
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD
Publication number
20120152605
Publication date
Jun 21, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
Publication number
20120068326
Publication date
Mar 22, 2012
Endicott Interconnect Technologies, Inc.
Rabindra N. Das
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...
Publication number
20110173809
Publication date
Jul 21, 2011
John M. Lauffer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR