James Jen-Ho Wang

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor bond pad patterns and method of formation
- Patent number 8,153,510
- Issue date Apr 10, 2012
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device assembly with integrated coil and method of forming...
- Patent number 7,868,729
- Issue date Jan 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate having through-wafer vias and method of forming
- Patent number 7,705,440
- Issue date Apr 27, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including an inductor
- Patent number 7,619,297
- Issue date Nov 17, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact surrounded by passivation and polymide and method therefor
- Patent number 7,615,866
- Issue date Nov 10, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including an inductor
- Patent number 7,524,731
- Issue date Apr 28, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chips semiconductor device assemblies and methods for fabrica...
- Patent number 7,339,275
- Issue date Mar 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- James Jen Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with strain relieving bump design
- Patent number 7,208,841
- Issue date Apr 24, 2007
- Motorola, Inc.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device with shear stress compensation
- Patent number 6,888,246
- Issue date May 3, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flexible circuit assembly and method thereof
- Publication number 20120320532
- Publication date Dec 20, 2012
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable anti-fuse wire bond pads
- Publication number 20120061796
- Publication date Mar 15, 2012
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated nano-farad capacitors and method of formation
- Publication number 20100301452
- Publication date Dec 2, 2010
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor bond pad patterns and method of formation
- Publication number 20100279489
- Publication date Nov 4, 2010
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...
- Publication number 20100225434
- Publication date Sep 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR
- Publication number 20100015793
- Publication date Jan 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING AN INDUCTOR
- Publication number 20090152676
- Publication date Jun 18, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING THROUGH-WAFER VIAS AND METHOD OF FORMING
- Publication number 20090065904
- Publication date Mar 12, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device including an inductor and a process of forming th...
- Publication number 20080079115
- Publication date Apr 3, 2008
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR
- Publication number 20070275549
- Publication date Nov 29, 2007
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS

James Jen-Ho Wang

Person

Patents Grantslast 30 patents

Semiconductor bond pad patterns and method of formation

Stacked device assembly with integrated coil and method of forming...

Substrate having through-wafer vias and method of forming

Electronic device including an inductor

Contact surrounded by passivation and polymide and method therefor

Process of forming an electronic device including an inductor

Multi-chips semiconductor device assemblies and methods for fabrica...

Semiconductor device with strain relieving bump design

Semiconductor power device with shear stress compensation

Patents Applicationslast 30 patents

Flexible circuit assembly and method thereof

Programmable anti-fuse wire bond pads

Integrated nano-farad capacitors and method of formation

Semiconductor bond pad patterns and method of formation

STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

ELECTRONIC DEVICE INCLUDING AN INDUCTOR

SUBSTRATE HAVING THROUGH-WAFER VIAS AND METHOD OF FORMING

Electronic device including an inductor and a process of forming th...

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR