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James Jian Zhang
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Folsom, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die over mold stacked semiconductor package
Patent number
11,948,917
Issue date
Apr 2, 2024
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder mask design for delamination prevention
Patent number
11,476,174
Issue date
Oct 18, 2022
Intel Corporation
James Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package including at least one topological feature on an encapsulan...
Patent number
8,653,675
Issue date
Feb 18, 2014
Micron Technology, Inc.
James Jian Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE OVER MOLD STACKED SEMICONDUCTOR PACKAGE
Publication number
20200343221
Publication date
Oct 29, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER MASK DESIGN FOR DELAMINATION PREVENTION
Publication number
20200135602
Publication date
Apr 30, 2020
Intel Corporation
James ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER
Publication number
20200118991
Publication date
Apr 16, 2020
Intel Corporation
James ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULAN...
Publication number
20110127642
Publication date
Jun 2, 2011
James Jian Zhang
H01 - BASIC ELECTRIC ELEMENTS