James John Casto

Person

Lakeway, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package incorporating programmable elements
- Patent number 6,791,157
- Issue date Sep 14, 2004
- Advanced Micro Devices, Inc.
- James John Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for specifying core voltage for a microprocessor by selectiv...
- Patent number 6,772,356
- Issue date Aug 3, 2004
- Advanced Micro Devices, Inc.
- Qadeer Ahmad Qureshi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for reconfiguring circuit board and integrated...
- Patent number 6,732,266
- Issue date May 4, 2004
- Advanced Micro Devices, Inc.
- Charles Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package incorporating camouflaged programmable e...
- Patent number 6,449,170
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Quang D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for positioning bond pads in a semiconductor die layout
- Patent number 5,498,767
- Issue date Mar 12, 1996
- Motorola, Inc.
- Wyatt A. Huddleston
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for making a lead-on-chip semiconductor device having periph...
- Patent number 5,455,200
- Issue date Oct 3, 1995
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-on chip semiconductor device having peripheral bond pads
- Patent number 5,381,036
- Issue date Jan 10, 1995
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor device and method for making the same
- Patent number 5,172,214
- Issue date Dec 15, 1992
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a thermally enhanced semiconductor device by hold...
- Patent number 5,147,821
- Issue date Sep 15, 1992
- Motorola, Inc.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a multichip semiconductor device having two...
- Patent number 5,147,815
- Issue date Sep 15, 1992
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor device utilizing a vacuum to ultim...
- Patent number 5,105,259
- Issue date Apr 14, 1992
- Motorola, Inc.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TAB bonded semiconductor device having off-chip power and ground di...
- Patent number 5,060,052
- Issue date Oct 22, 1991
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic pad array electronic AC device
- Patent number 5,045,914
- Issue date Sep 3, 1991
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple layer lead frame
- Patent number 5,014,113
- Issue date May 7, 1991
- Motorola, Inc.
- James J. Casto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flagless semiconductor package
- Patent number 4,924,291
- Issue date May 8, 1990
- Motorola Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS

James John Casto

Person

Patents Grantslast 30 patents

Integrated circuit package incorporating programmable elements

System for specifying core voltage for a microprocessor by selectiv...

Method and apparatus for reconfiguring circuit board and integrated...

Integrated circuit package incorporating camouflaged programmable e...

Method for positioning bond pads in a semiconductor die layout

Method for making a lead-on-chip semiconductor device having periph...

Lead-on chip semiconductor device having peripheral bond pads

Leadless semiconductor device and method for making the same

Method for making a thermally enhanced semiconductor device by hold...

Method for fabricating a multichip semiconductor device having two...

Thermally enhanced semiconductor device utilizing a vacuum to ultim...

TAB bonded semiconductor device having off-chip power and ground di...

Plastic pad array electronic AC device

Multiple layer lead frame

Flagless semiconductor package