James K. Kai

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 12,243,865
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing erase disturb in NAND
- Patent number 12,087,371
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with separated contact regions and...
- Patent number 11,996,153
- Issue date May 28, 2024
- SanDisk Technologies LLC
- James Kai
- G11 - INFORMATION STORAGE
Information Patent Grant
Dynamic word line reconfiguration for NAND structure
- Patent number 11,990,185
- Issue date May 21, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with wiggled drain-select-level iso...
- Patent number 11,805,649
- Issue date Oct 31, 2023
- SanDisk Technologies LLC
- Srinivas Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor die assembly containing through-stack via stru...
- Patent number 11,587,920
- Issue date Feb 21, 2023
- SanDisk Technologies LLC
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having on-pitch drain select gate e...
- Patent number 11,552,094
- Issue date Jan 10, 2023
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device employing thinned insulating layers...
- Patent number 11,489,043
- Issue date Nov 1, 2022
- SanDisk Technologies LLC
- James Kai
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory with memory array between circuits
- Patent number 11,481,154
- Issue date Oct 25, 2022
- SanDisk Technologies LLC
- Deepanshu Dutta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory device employing thinned insulating layers...
- Patent number 11,398,496
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional ferroelectric memory
- Patent number 11,380,709
- Issue date Jul 5, 2022
- SanDisk Technologies LLC
- Yingda Dong
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,355,486
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,201,107
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,195,781
- Issue date Dec 7, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,195,857
- Issue date Dec 7, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
- Patent number 11,127,729
- Issue date Sep 21, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including self-aligned dielectric i...
- Patent number 11,043,455
- Issue date Jun 22, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having on-pitch drain select gate e...
- Patent number 11,037,943
- Issue date Jun 15, 2021
- SanDisk Technologies LLC
- Muneyuki Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing alternating stack of sou...
- Patent number 11,018,153
- Issue date May 25, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 10,985,169
- Issue date Apr 20, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing alternating stack of sou...
- Patent number 10,950,626
- Issue date Mar 16, 2021
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with drain-select-level isolation s...
- Patent number 10,943,917
- Issue date Mar 9, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-array conductive via structures for a three-dimensional mem...
- Patent number 10,840,260
- Issue date Nov 17, 2020
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with pool capacitor
- Patent number 10,825,827
- Issue date Nov 3, 2020
- SanDisk Technologies LLC
- Mohan Dunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with pool capacitor
- Patent number 10,818,685
- Issue date Oct 27, 2020
- SanDisk Technologies LLC
- Mohan Dunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bond pad-based power sup...
- Patent number 10,748,894
- Issue date Aug 18, 2020
- SanDisk Technologies LLC
- Murshed Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with drain-select-level isolation s...
- Patent number 10,748,927
- Issue date Aug 18, 2020
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a bulk substrate from a bonded assembly of wafers
- Patent number 10,727,216
- Issue date Jul 28, 2020
- SanDisk Technologies LLC
- James Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with drain-select-level isolation s...
- Patent number 10,685,978
- Issue date Jun 16, 2020
- SanDisk Technologies LLC
- Ching-Huang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with drain-select-level isolation s...
- Patent number 10,685,979
- Issue date Jun 16, 2020
- SanDisk Technologies LLC
- Ching-Huang Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...
- Publication number 20240290714
- Publication date Aug 29, 2024
- SANDISK TECHNOLOGIES LLC
- Mark D. KRAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...
- Publication number 20240172431
- Publication date May 23, 2024
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL SUPPORT BRID...
- Publication number 20240155841
- Publication date May 9, 2024
- SANDISK TECHNOLOGIES LLC
- Seyyed Ehsan Esfahani RASHIDI
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...
- Publication number 20240127864
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Masaaki HIGASHITANI
- G11 - INFORMATION STORAGE
Information Patent Application
PREVENTING ERASE DISTURB IN NAND
- Publication number 20240105271
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
DYNAMIC WORD LINE RECONFIGURATION FOR NAND STRUCTURE
- Publication number 20240055051
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
LOW POWER READ METHOD AND A MEMORY DEVICE CAPABLE THEREOF
- Publication number 20230282288
- Publication date Sep 7, 2023
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...
- Publication number 20230163116
- Publication date May 25, 2023
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230044232
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH MEMORY ARRAY BETWEEN CIRCUITS
- Publication number 20220229588
- Publication date Jul 21, 2022
- SANDISK TECHNOLOGIES LLC
- Deepanshu Dutta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...
- Publication number 20220028846
- Publication date Jan 27, 2022
- SANDISK TECHNOLOGIES LLC
- Johann ALSMEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH WIGGLED DRAIN-SELECT-LEVEL ISO...
- Publication number 20210358946
- Publication date Nov 18, 2021
- SANDISK TECHNOLOGIES LLC
- Srinivas PULUGURTHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING LAYERS...
- Publication number 20210335999
- Publication date Oct 28, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING LAYERS...
- Publication number 20210335805
- Publication date Oct 28, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...
- Publication number 20210210503
- Publication date Jul 8, 2021
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOU...
- Publication number 20210050360
- Publication date Feb 18, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOU...
- Publication number 20210050359
- Publication date Feb 18, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20210035965
- Publication date Feb 4, 2021
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC I...
- Publication number 20210028111
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING ON-PITCH DRAIN SELECT GATE E...
- Publication number 20210005617
- Publication date Jan 7, 2021
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING A BULK SUBSTRATE FROM A BONDED ASSEMBLY OF WAFERS
- Publication number 20200357783
- Publication date Nov 12, 2020
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...
- Publication number 20200286905
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258904
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258817
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258816
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...
- Publication number 20200251489
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...
- Publication number 20200251488
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-ARRAY CONDUCTIVE VIA STRUCTURES FOR A THREE-DIMENSIONAL MEM...
- Publication number 20200235120
- Publication date Jul 23, 2020
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BOND PAD-BASED POWER SUP...
- Publication number 20200235090
- Publication date Jul 23, 2020
- SANDISK TECHNOLOGIES LLC
- Murshed CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL FERROELECTRIC MEMORY
- Publication number 20200075631
- Publication date Mar 5, 2020
- SANDISK TECHNOLOGIES LLC
- Yingda Dong
- G11 - INFORMATION STORAGE

James K. Kai

Person

Patents Grantslast 30 patents

Bonded semiconductor die assembly containing through-stack via stru...

Preventing erase disturb in NAND

Three-dimensional memory device with separated contact regions and...

Dynamic word line reconfiguration for NAND structure

Three-dimensional memory device with wiggled drain-select-level iso...

Bonded semiconductor die assembly containing through-stack via stru...

Three-dimensional memory device having on-pitch drain select gate e...

Three-dimensional memory device employing thinned insulating layers...

Non-volatile memory with memory array between circuits

Three-dimensional memory device employing thinned insulating layers...

Three dimensional ferroelectric memory

Bonded three-dimensional memory devices and methods of making the s...

Bonded three-dimensional memory devices and methods of making the s...

Bonded three-dimensional memory devices and methods of making the s...

Bonded three-dimensional memory devices and methods of making the s...

Method for removing a bulk substrate from a bonded assembly of wafers

Three-dimensional memory device including self-aligned dielectric i...

Three-dimensional memory device having on-pitch drain select gate e...

Three-dimensional memory device containing alternating stack of sou...

Three-dimensional device with bonded structures including a support...

Three-dimensional memory device containing alternating stack of sou...

Three-dimensional memory device with drain-select-level isolation s...

Through-array conductive via structures for a three-dimensional mem...

Non-volatile memory with pool capacitor

Non-volatile memory with pool capacitor

Three-dimensional memory device containing bond pad-based power sup...

Three-dimensional memory device with drain-select-level isolation s...

Method for removing a bulk substrate from a bonded assembly of wafers

Three-dimensional memory device with drain-select-level isolation s...

Three-dimensional memory device with drain-select-level isolation s...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL WORD LINE CO...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE LINES AND MET...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL SUPPORT BRID...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY SEPARATED SOURC...

PREVENTING ERASE DISTURB IN NAND

DYNAMIC WORD LINE RECONFIGURATION FOR NAND STRUCTURE

LOW POWER READ METHOD AND A MEMORY DEVICE CAPABLE THEREOF

BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

NON-VOLATILE MEMORY WITH MEMORY ARRAY BETWEEN CIRCUITS

BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICE WITH WIGGLED DRAIN-SELECT-LEVEL ISO...

THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING LAYERS...

THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING LAYERS...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOU...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOU...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SELF-ALIGNED DIELECTRIC I...

THREE-DIMENSIONAL MEMORY DEVICE HAVING ON-PITCH DRAIN SELECT GATE E...

METHOD FOR REMOVING A BULK SUBSTRATE FROM A BONDED ASSEMBLY OF WAFERS

THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...

THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...

THROUGH-ARRAY CONDUCTIVE VIA STRUCTURES FOR A THREE-DIMENSIONAL MEM...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BOND PAD-BASED POWER SUP...

THREE DIMENSIONAL FERROELECTRIC MEMORY