James K. Lake

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package mounting
- Patent number 9,622,356
- Issue date Apr 11, 2017
- Lockheed Martin Corporation
- Tom Rovere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film solder paste deposition method and tools
- Patent number 6,145,735
- Issue date Nov 14, 2000
- Lockheed Martin Corporation
- Michael T. Mallery
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering iron tip
- Patent number 6,019,270
- Issue date Feb 1, 2000
- Lockheed Martin Corporation
- Stephen E. Boll
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
- Patent number 5,414,303
- Issue date May 9, 1995
- IBM Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free, tin, antimony, bismtuh, copper solder alloy
- Patent number 5,411,703
- Issue date May 2, 1995
- International Business Machines Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature, lead-free, tin based solder composition
- Patent number 5,393,489
- Issue date Feb 28, 1995
- International Business Machines Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free, tin-bismuth solder alloys
- Patent number 5,368,814
- Issue date Nov 29, 1994
- International Business Machines, Inc.
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
- Patent number 5,344,607
- Issue date Sep 6, 1994
- International Business Machines Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free, high temperature, tin based multi-component solder
- Patent number 5,328,660
- Issue date Jul 12, 1994
- International Business Machines Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Mounting
- Publication number 20140268605
- Publication date Sep 18, 2014
- Tom Rovere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James K. Lake

Person

Patents Grantslast 30 patents

Electronic package mounting

Thin film solder paste deposition method and tools

Soldering iron tip

Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium

Lead-free, tin, antimony, bismtuh, copper solder alloy

High temperature, lead-free, tin based solder composition

Lead free, tin-bismuth solder alloys

Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium

Lead-free, high temperature, tin based multi-component solder

Patents Applicationslast 30 patents

Electronic Package Mounting