James Kuss

Person

Hudson, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming silicon germanium and silicon fins on oxide from...
- Patent number 10,283,418
- Issue date May 7, 2019
- International Business Machines Corporation
- Hong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including groups of nanowires of different sem...
- Patent number 10,134,759
- Issue date Nov 20, 2018
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon germanium and silicon fins on oxide from bulk wafer
- Patent number 10,074,577
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Hong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs of different compositions formed on a same substrate
- Patent number 9,530,777
- Issue date Dec 27, 2016
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the formation of silicon and silicon-germanium fin struc...
- Patent number 9,461,174
- Issue date Oct 4, 2016
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon germanium and silicon fins on oxide from bulk wafer
- Patent number 9,418,900
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Hong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including groups of stacked nanowires and rela...
- Patent number 9,257,450
- Issue date Feb 9, 2016
- STMicroelectronics, Inc.
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer join process and multilevel thin film module
- Patent number 6,998,327
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SILICON GERMANIUM AND SILICON FINS ON OXIDE FROM BULK WAFER
- Publication number 20180315668
- Publication date Nov 1, 2018
- International Business Machines Corporation
- Hong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON GERMANIUM AND SILICON FINS ON OXIDE FROM BULK WAFER
- Publication number 20170018465
- Publication date Jan 19, 2017
- International Business Machines Corporation
- Hong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE FORMATION OF SILICON AND SILICON-GERMANIUM FIN STRUC...
- Publication number 20160035872
- Publication date Feb 4, 2016
- STMicroelectronics, Inc.
- NICOLAS LOUBET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO FORM FIN STRUCTURES OF DIFFERENT COMPOSITI...
- Publication number 20150255457
- Publication date Sep 10, 2015
- International Business Machines Corporation
- NICOLAS LOUBET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GROUPS OF NANOWIRES OF DIFFERENT SEM...
- Publication number 20150236050
- Publication date Aug 20, 2015
- International Business Machines Corporation
- NICOLAS LOUBET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GROUPS OF STACKED NANOWIRES AND RELA...
- Publication number 20150236051
- Publication date Aug 20, 2015
- International Business Machines Corporation
- NICOLAS LOUBET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTROFORMED SCREENING MASK AND METHOD OF MAKING THE SAME
- Publication number 20060243700
- Publication date Nov 2, 2006
- International Business Machines Corporation
- Robert P. Rippstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin film transfer join process and multilevel thin film module
- Publication number 20040097078
- Publication date May 20, 2004
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method of forming silicon germanium and silicon fins on oxide from...

Semiconductor device including groups of nanowires of different sem...

Silicon germanium and silicon fins on oxide from bulk wafer

FinFETs of different compositions formed on a same substrate

Method for the formation of silicon and silicon-germanium fin struc...

Silicon germanium and silicon fins on oxide from bulk wafer

Semiconductor device including groups of stacked nanowires and rela...

Thin film transfer join process and multilevel thin film module

Patents Applicationslast 30 patents

SILICON GERMANIUM AND SILICON FINS ON OXIDE FROM BULK WAFER

SILICON GERMANIUM AND SILICON FINS ON OXIDE FROM BULK WAFER

METHOD FOR THE FORMATION OF SILICON AND SILICON-GERMANIUM FIN STRUC...

METHODS AND APPARATUS TO FORM FIN STRUCTURES OF DIFFERENT COMPOSITI...

SEMICONDUCTOR DEVICE INCLUDING GROUPS OF NANOWIRES OF DIFFERENT SEM...

SEMICONDUCTOR DEVICE INCLUDING GROUPS OF STACKED NANOWIRES AND RELA...

COMPOSITE ELECTROFORMED SCREENING MASK AND METHOD OF MAKING THE SAME

Thin film transfer join process and multilevel thin film module