TREA

James L. Martin

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  • Merrick, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electrolytic copper plating method
    • Patent number 6,444,110
    • Issue date Sep 3, 2002
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Programmed pulse electroplating process
    • Patent number 6,402,924
    • Issue date Jun 11, 2002
    • Shipley Company LLC
    • James L. Martin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroless gold plating solution and process
    • Patent number 6,383,269
    • Issue date May 7, 2002
    • Shipley Company, L.L.C.
    • Michael P. Toben
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Programmed pulse electroplating process
    • Patent number 6,071,398
    • Issue date Jun 6, 2000
    • Learonal, Inc.
    • James L. Martin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Alkaline baths and methods for electrodeposition of palladium and p...
    • Patent number 4,741,818
    • Issue date May 3, 1988
    • Learonal, Inc.
    • Fred I. Nobel
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electrical contacts and methods of making contacts by electrodeposi...
    • Patent number 4,628,165
    • Issue date Dec 9, 1986
    • Learonal, Inc.
    • Fred I. Nobel
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Palladium plating
    • Patent number 4,622,110
    • Issue date Nov 11, 1986
    • Learonal, Inc.
    • James L. Martin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Palladium plating
    • Patent number 4,545,868
    • Issue date Oct 8, 1985
    • Learonal, Inc.
    • James L. Martin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060183328
    • Publication date Aug 17, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Alloy composition and plating method
    • Publication number 20060065538
    • Publication date Mar 30, 2006
    • Shipley Company, L.L.C.
    • Robert A. Schetty
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060065537
    • Publication date Mar 30, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20030010646
    • Publication date Jan 16, 2003
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Alloy composition and plating method
    • Publication number 20020166774
    • Publication date Nov 14, 2002
    • Shipley Company, L.L.C.
    • Robert A. Schetty
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR