James L. Oborny

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Sachse, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Interposers having cuts through an insulating substrate
- Patent number 10,962,571
- Issue date Mar 30, 2021
- Texas Instruments Incorporated
- Thiha Shwe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral coupling enabled topside only dual-side testing of TSV die...
- Patent number 8,471,577
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Daniel Joseph Stillman
- G01 - MEASURING TESTING
Information Patent Grant
Through carrier dual side loop-back testing of TSV die after die at...
- Patent number 8,344,749
- Issue date Jan 1, 2013
- Texas Instruments Incorporated
- Daniel Joseph Stillman
- G01 - MEASURING TESTING
Information Patent Grant
System and method for site-to-site yield comparison while testing i...
- Patent number 6,943,573
- Issue date Sep 13, 2005
- Texas Instruments Incorporated
- James L. Oborny
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSERS HAVING CUTS THROUGH AN INSULATING SUBSTRATE
- Publication number 20190204359
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Thiha SHWE
- G01 - MEASURING TESTING
Information Patent Application
LATERAL COUPLING ENABLED TOPSIDE ONLY DUAL-SIDE TESTING OF TSV DIE...
- Publication number 20110304349
- Publication date Dec 15, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Joseph Stillman
- G01 - MEASURING TESTING
Information Patent Application
THROUGH CARRIER DUAL SIDE LOOP-BACK TESTING OF TSV DIE AFTER DIE AT...
- Publication number 20110298488
- Publication date Dec 8, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Joseph Stillman
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR SITE-TO-SITE YIELD COMPARISON WHILE TESTING I...
- Publication number 20050212538
- Publication date Sep 29, 2005
- TEXAS INSTRUMENTS INCORPORATED
- James L. Oborny
- G01 - MEASURING TESTING