James M. Derderian

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems for thermally treating conductive elements on semiconductor...
- Patent number 11,967,576
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 11,139,258
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for reflowing conductive elements of semico...
- Patent number 11,081,458
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier removal by use of multilayer foil
- Patent number 10,861,765
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- James M. Derderian
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,748,878
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,580,746
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,573,612
- Issue date Feb 25, 2020
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing semiconductor dice and fabricating assemblie...
- Patent number 10,559,495
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,559,551
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device test apparatuses comprising at least one test...
- Patent number 10,481,200
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Carrier removal by use of multilayer foil
- Patent number 10,431,519
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- James M. Derderian
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,297,577
- Issue date May 21, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 10,163,830
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 10,163,755
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing semiconductor dice and fabricating assemblie...
- Patent number 10,163,693
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of testing semiconductor devices comprising a die stack hav...
- Patent number 10,126,357
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with improved conductive properties and asso...
- Patent number 9,837,383
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,837,396
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 9,768,149
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device test apparatuses
- Patent number 9,733,304
- Issue date Aug 15, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 9,691,746
- Issue date Jun 27, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads with thermal pathways
- Patent number 9,515,002
- Issue date Dec 6, 2016
- Micron Technology, Inc.
- Jaspreet S Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,443,744
- Issue date Sep 13, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with improved conductive properties and asso...
- Patent number 9,412,675
- Issue date Aug 9, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling semiconductor devices in stacked arrangement...
- Patent number 8,101,459
- Issue date Jan 24, 2012
- Micron Technology, Inc.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing imaging device packages
- Patent number 8,012,776
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- James Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,858,420
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units
- Patent number 7,786,574
- Issue date Aug 31, 2010
- Aptina Imaging Corp.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MASK FAULT FIBER OPTICS SENSOR
- Publication number 20240284590
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR THERMALLY TREATING CONDUCTIVE ELEMENTS ON SEMICONDUCTOR...
- Publication number 20210335741
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20200176404
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190348401
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Removal By Use of Multilayer Foil
- Publication number 20190341325
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- James M. Derderian
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...
- Publication number 20190252337
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190229096
- Publication date Jul 25, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING SEMICONDUCTOR DICE AND FABRICATING ASSEMBLIE...
- Publication number 20190198388
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE TEST APPARATUSES
- Publication number 20190072608
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20180374810
- Publication date Dec 27, 2018
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20180358314
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20180308785
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20180040592
- Publication date Feb 8, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20170365584
- Publication date Dec 21, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TESTING SEMICONDUCTOR DEVICES
- Publication number 20170336470
- Publication date Nov 23, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20170229439
- Publication date Aug 10, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20170053881
- Publication date Feb 23, 2017
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20160372452
- Publication date Dec 22, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20160343689
- Publication date Nov 24, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20160343687
- Publication date Nov 24, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PADS WITH THERMAL PATHWAYS
- Publication number 20160233139
- Publication date Aug 11, 2016
- Micron Technology, Inc.
- JASPREET S. GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS
- Publication number 20160084905
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20160013173
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20160013115
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20150333026
- Publication date Nov 19, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING IMAGING DEVICE PACKAGES
- Publication number 20100167451
- Publication date Jul 1, 2010
- Micron Technology, Inc.
- James M. Derderian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES...
- Publication number 20090243051
- Publication date Oct 1, 2009
- Micron Technology, Inc.
- Kiran Kumar Vanam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD STRUCTURES FOR SEMICONDUCTOR CO...
- Publication number 20090243012
- Publication date Oct 1, 2009
- Micron Technology, Inc.
- Kiran Kumar Vanam
- H01 - BASIC ELECTRIC ELEMENTS

James M. Derderian

Person

Patents Grantslast 30 patents

Systems for thermally treating conductive elements on semiconductor...

Methods of manufacturing stacked semiconductor die assemblies with...

Bonding pads with thermal pathways

Methods and apparatuses for reflowing conductive elements of semico...

Carrier removal by use of multilayer foil

Semiconductor device assembly with heat transfer structure formed f...

Bonding pads with thermal pathways

Bonding pads with thermal pathways

Methods for processing semiconductor dice and fabricating assemblie...

Semiconductor device assembly with heat transfer structure formed f...

Semiconductor device test apparatuses comprising at least one test...

Carrier removal by use of multilayer foil

Semiconductor device assembly with heat transfer structure formed f...

Bonding pads with thermal pathways

Methods of manufacturing stacked semiconductor die assemblies with...

Methods for processing semiconductor dice and fabricating assemblie...

Methods of testing semiconductor devices comprising a die stack hav...

Method for mount tape die release system for thin die ejection

Interconnect structure with improved conductive properties and asso...

Stacked semiconductor die assemblies with high efficiency thermal p...

Semiconductor device assembly with heat transfer structure formed f...

Semiconductor device test apparatuses

Methods of manufacturing stacked semiconductor die assemblies with...

Bonding pads with thermal pathways

Stacked semiconductor die assemblies with high efficiency thermal p...

Interconnect structure with improved conductive properties and asso...

Methods for assembling semiconductor devices in stacked arrangement...

Methods of manufacturing imaging device packages

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imaging units

Patents Applicationslast 30 patents

SOLDER MASK FAULT FIBER OPTICS SENSOR

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SYSTEMS FOR THERMALLY TREATING CONDUCTIVE ELEMENTS ON SEMICONDUCTOR...

BONDING PADS WITH THERMAL PATHWAYS

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

Carrier Removal By Use of Multilayer Foil

METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

METHODS FOR PROCESSING SEMICONDUCTOR DICE AND FABRICATING ASSEMBLIE...

SEMICONDUCTOR DEVICE TEST APPARATUSES

BONDING PADS WITH THERMAL PATHWAYS

BONDING PADS WITH THERMAL PATHWAYS

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

METHODS OF TESTING SEMICONDUCTOR DEVICES

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

BONDING PADS WITH THERMAL PATHWAYS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

BONDING PADS WITH THERMAL PATHWAYS

APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

METHODS OF MANUFACTURING IMAGING DEVICE PACKAGES

INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES...

ELECTROMAGNETIC INTERFERENCE SHIELD STRUCTURES FOR SEMICONDUCTOR CO...