James M. PARSEY JR.

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die singulation methods
- Patent number 9,196,511
- Issue date Nov 24, 2015
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL
- Publication number 20160035599
- Publication date Feb 4, 2016
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHODS
- Publication number 20150027290
- Publication date Jan 29, 2015
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- B28 - WORKING CEMENT, CLAY, OR STONE