James O. Anderson

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Robbinsdale, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball pattern forming
- Patent number 8,813,350
- Issue date Aug 26, 2014
- Seagate Technology LLC
- Niandong Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Solder Ball Pattern Forming
- Publication number 20120304456
- Publication date Dec 6, 2012
- SEAGATE TECHNOLOGY LLC
- Niandong Liu
- H01 - BASIC ELECTRIC ELEMENTS