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James P. Letterman, JR.
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Mesa, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing a semiconductor component
Patent number
8,324,026
Issue date
Dec 4, 2012
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package having down-set leads and method
Patent number
8,319,323
Issue date
Nov 27, 2012
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for manufacturing a semiconductor component and structure th...
Patent number
8,071,427
Issue date
Dec 6, 2011
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a molded array package device having an exposed t...
Patent number
7,901,990
Issue date
Mar 8, 2011
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method therefor
Patent number
7,825,505
Issue date
Nov 2, 2010
Semiconductor Components Industries, LLC
Phillip Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Encapsulated chip scale package having flip-chip on lead frame stru...
Patent number
7,656,048
Issue date
Feb 2, 2010
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method therefor
Patent number
7,638,863
Issue date
Dec 29, 2009
Semiconductor Components Industries, LLC
Phillip Celaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a molded array package device having an exposed t...
Patent number
7,602,054
Issue date
Oct 13, 2009
Semiconductor Components Industries, LLC
James P. Letterman, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated chip scale package having flip-chip on lead frame stru...
Patent number
7,439,100
Issue date
Oct 21, 2008
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor package and leadframe therefor
Patent number
7,109,064
Issue date
Sep 19, 2006
Semiconductor Components Industries, LLC
Joseph K. Fauty
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
Publication number
20110281397
Publication date
Nov 17, 2011
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
Publication number
20100187663
Publication date
Jul 29, 2010
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
Publication number
20100052145
Publication date
Mar 4, 2010
Phillip Celaya
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD OF FORMING A MOLDED ARRAY PACKAGE DEVICE HAVING AN EXPOSED T...
Publication number
20100019367
Publication date
Jan 28, 2010
James P. Letterman, JR.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD
Publication number
20100000772
Publication date
Jan 7, 2010
Semiconductor Components Industries, LLC
James P. Letterman, JR.
H01 - BASIC ELECTRIC ELEMENTS