James P. Mellody

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill process and materials for singulated heat spreader stiffe...
- Patent number 8,987,894
- Issue date Mar 24, 2015
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill process and materials for singulated heat spreader stiffe...
- Patent number 8,765,528
- Issue date Jul 1, 2014
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill process and materials for singulated heat spreader stiffe...
- Patent number 8,390,112
- Issue date Mar 5, 2013
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 8,163,598
- Issue date Apr 24, 2012
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making microelectronic package using integrated heat spre...
- Patent number 8,067,256
- Issue date Nov 29, 2011
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 7,892,883
- Issue date Feb 22, 2011
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a microelectronic die to a substrate and arrangem...
- Patent number 7,364,943
- Issue date Apr 29, 2008
- Intel Corporation
- James P. Mellody
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...
- Publication number 20240213074
- Publication date Jun 27, 2024
- Intel Corporation
- Mark SALTAS
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...
- Publication number 20160043014
- Publication date Feb 11, 2016
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...
- Publication number 20140312487
- Publication date Oct 23, 2014
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...
- Publication number 20130168846
- Publication date Jul 4, 2013
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPRE...
- Publication number 20110291304
- Publication date Dec 1, 2011
- Intel Corporation
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clipless Integrated Heat Spreader Process and Materials
- Publication number 20110129963
- Publication date Jun 2, 2011
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...
- Publication number 20100079957
- Publication date Apr 1, 2010
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS
- Publication number 20090298235
- Publication date Dec 3, 2009
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making Microelectronic Package Using Integrated Heat Spre...
- Publication number 20090085195
- Publication date Apr 2, 2009
- Sabina J. Houle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX OVERSPRAY REDUCTION APPARATUS, SYSTEMS, AND METHODS
- Publication number 20080156895
- Publication date Jul 3, 2008
- James P. Mellody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated solder and heat spreader fabrication
- Publication number 20070035012
- Publication date Feb 15, 2007
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding a microelectronic die to a substrate and arrangem...
- Publication number 20060263935
- Publication date Nov 23, 2006
- Intel Corporation
- James P. Mellody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal interface material bonding
- Publication number 20050133934
- Publication date Jun 23, 2005
- James P. Mellody
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated solder and heat spreader fabrication
- Publication number 20050121776
- Publication date Jun 9, 2005
- Carl L. Deppisch
- H01 - BASIC ELECTRIC ELEMENTS

James P. Mellody

Person

Patents Grantslast 30 patents

Thermal compression bonder nozzle with vacuum relief features

Thermal compression bonder nozzle with vacuum relief features

Underfill process and materials for singulated heat spreader stiffe...

Underfill process and materials for singulated heat spreader stiffe...

Underfill process and materials for singulated heat spreader stiffe...

Clipless integrated heat spreader process and materials

Method of making microelectronic package using integrated heat spre...

Clipless integrated heat spreader process and materials

Method of bonding a microelectronic die to a substrate and arrangem...

Patents Applicationslast 30 patents

ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...

METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPRE...

Clipless Integrated Heat Spreader Process and Materials

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFE...

CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS

Method of Making Microelectronic Package Using Integrated Heat Spre...

FLUX OVERSPRAY REDUCTION APPARATUS, SYSTEMS, AND METHODS

Integrated solder and heat spreader fabrication

Method of bonding a microelectronic die to a substrate and arrangem...

Thermal interface material bonding

Integrated solder and heat spreader fabrication