James P. Smith

Person

Chelmsford, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 11,594,470
- Issue date Feb 28, 2023
- Massachesetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 11,322,426
- Issue date May 3, 2022
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 11,018,077
- Issue date May 25, 2021
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 10,903,141
- Issue date Jan 26, 2021
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 10,665,529
- Issue date May 26, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 10,651,112
- Issue date May 12, 2020
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device array backframe with integral manifolding for high performan...
- Patent number 10,512,152
- Issue date Dec 17, 2019
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED PATCH ANTENNA HAVING SPACERS
- Publication number 20240421487
- Publication date Dec 19, 2024
- Massachusetts Institute of Technology
- Pierre A. DUFILIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20210265240
- Publication date Aug 26, 2021
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20210134703
- Publication date May 6, 2021
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20200312746
- Publication date Oct 1, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20200168526
- Publication date May 28, 2020
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20200027819
- Publication date Jan 23, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Array Backframe With Integral Manifolding For High Performan...
- Publication number 20190029105
- Publication date Jan 24, 2019
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20190013258
- Publication date Jan 10, 2019
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD FOR HIGH POWER COMPONENTS
- Publication number 20170325327
- Publication date Nov 9, 2017
- Massachusetts Institute of Technology
- James P. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James P. Smith

Person

Patents Grantslast 30 patents

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Device array backframe with integral manifolding for high performan...

Patents Applicationslast 30 patents

STACKED PATCH ANTENNA HAVING SPACERS

Modular Microjet Cooling Of Packaged Electronic Components

Thermal Management Of RF Devices Using Embedded Microjet Arrays

Modular Microjet Cooling Of Packaged Electronic Components

Thermal Management Of RF Devices Using Embedded Microjet Arrays

Modular Microjet Cooling Of Packaged Electronic Components

Device Array Backframe With Integral Manifolding For High Performan...

Thermal Management Of RF Devices Using Embedded Microjet Arrays

PRINTED CIRCUIT BOARD FOR HIGH POWER COMPONENTS