James R. Griffiths

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redistributed chip packaging with thermal contact to device backside
- Patent number 8,217,511
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifiers having improved protection against avalanche current
- Patent number 7,795,980
- Issue date Sep 14, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Removable layer manufacturing method
- Patent number 7,741,194
- Issue date Jun 22, 2010
- Freescale Semiconductor, Inc.
- James R. Griffiths
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifiers having improved startup linearization and related...
- Patent number 7,701,285
- Issue date Apr 20, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
RF amplifier with stacked transistors, transmitting device, and met...
- Patent number 7,489,202
- Issue date Feb 10, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20120252169
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIERS HAVING IMPROVED PROTECTION AGAINST AVALANCHE CURRENT
- Publication number 20090309663
- Publication date Dec 17, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIERS HAVING IMPROVED STARTUP LINEARIZATION AND RELATED...
- Publication number 20090237156
- Publication date Sep 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
REMOVABLE LAYER MANUFACTURING METHOD
- Publication number 20090176348
- Publication date Jul 9, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIER WITH STACKED TRANSISTORS, TRANSMITTING DEVICE, AND MET...
- Publication number 20090051435
- Publication date Feb 26, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James R. Griffiths
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
- Publication number 20090032933
- Publication date Feb 5, 2009
- Neil T. Tracht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for a hybrid antenna switching system
- Publication number 20080102762
- Publication date May 1, 2008
- Lianjun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

James R. Griffiths

Person

Patents Grantslast 30 patents

Redistributed chip packaging with thermal contact to device backside

Power amplifiers having improved protection against avalanche current

Removable layer manufacturing method

Power amplifiers having improved startup linearization and related...

RF amplifier with stacked transistors, transmitting device, and met...

Patents Applicationslast 30 patents

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

POWER AMPLIFIERS HAVING IMPROVED PROTECTION AGAINST AVALANCHE CURRENT

POWER AMPLIFIERS HAVING IMPROVED STARTUP LINEARIZATION AND RELATED...

REMOVABLE LAYER MANUFACTURING METHOD

RF AMPLIFIER WITH STACKED TRANSISTORS, TRANSMITTING DEVICE, AND MET...

REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE

Methods and apparatus for a hybrid antenna switching system