James R. Salimeno III

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Fairfax, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Inspection methods and structures for visualizing and/or detecting...
- Patent number 7,230,335
- Issue date Jun 12, 2007
- International Business Machines Corporation
- Jerome L. Cann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial wafer bonding and dicing
- Patent number 7,078,320
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PARTIAL WAFER BONDING AND DICING
- Publication number 20060035443
- Publication date Feb 16, 2006
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS