James R. Stack

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for repairing or modifying surface connections on circuit...
- Patent number 7,199,309
- Issue date Apr 3, 2007
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for implementing enhanced interconnection perf...
- Patent number 7,173,193
- Issue date Feb 6, 2007
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for repairing or modifying surface connections...
- Patent number 6,912,780
- Issue date Jul 5, 2005
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a substructure of a multilayered laminate
- Patent number 6,832,436
- Issue date Dec 21, 2004
- International Business Machines Corporation
- Donald O. Anstrom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for repairing or modifying surface connections...
- Patent number 6,784,377
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board structure with z-axis interconnections
- Patent number 6,593,534
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Eye prosthesis
- Patent number 6,576,013
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Mark Budman
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Zero insertion force compliant pin contact and assembly
- Patent number 6,565,367
- Issue date May 20, 2003
- International Business Machines Corporation
- Mark Budman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peripheral power board structure
- Patent number 6,426,466
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Bruce J. Chamberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive substructures of a multilayered laminate
- Patent number 6,407,341
- Issue date Jun 18, 2002
- International Business Machines Corporation
- Donald O. Anstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board wireability enhancement
- Patent number 6,232,564
- Issue date May 15, 2001
- International Business Machines Corporation
- Steven Frederick Arndt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clover-leaf solder mask opening
- Patent number 6,150,061
- Issue date Nov 21, 2000
- International Business Machines Corporation
- James Richard Stack
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clover-leaf solder mask opening
- Patent number 6,078,013
- Issue date Jun 20, 2000
- International Business Machines Corporation
- James Richard Stack
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structure for repairing or modifying surface connections on circuit...
- Publication number 20050239347
- Publication date Oct 27, 2005
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for repairing or modifying surface connections...
- Publication number 20040216919
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for implementing enhanced interconnection perf...
- Publication number 20040188135
- Publication date Sep 30, 2004
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for repairing or modifying surface connections...
- Publication number 20020179324
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Bruce John Chamberlin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Land grid array (LGA) pad repair structure and method
- Publication number 20020166696
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Bruce J. Chamberlin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board structure with z-axis interconnections
- Publication number 20020131229
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive substructures of a multilayered laminate
- Publication number 20020100613
- Publication date Aug 1, 2002
- International Business Machines Corporation
- Donald O. Anstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero insertion force compliant pin contact and assembly
- Publication number 20020094708
- Publication date Jul 18, 2002
- Mark Budman
- H01 - BASIC ELECTRIC ELEMENTS

James R. Stack

Person

Patents Grantslast 30 patents

Structure for repairing or modifying surface connections on circuit...

Method and structure for implementing enhanced interconnection perf...

Method and structure for repairing or modifying surface connections...

Method for forming a substructure of a multilayered laminate

Method and structure for repairing or modifying surface connections...

Printed wiring board structure with z-axis interconnections

Eye prosthesis

Zero insertion force compliant pin contact and assembly

Peripheral power board structure

Conductive substructures of a multilayered laminate

Printed wiring board wireability enhancement

Clover-leaf solder mask opening

Clover-leaf solder mask opening

Patents Applicationslast 30 patents

Structure for repairing or modifying surface connections on circuit...

Method and structure for repairing or modifying surface connections...

Method and structure for implementing enhanced interconnection perf...

Method and structure for repairing or modifying surface connections...

Land grid array (LGA) pad repair structure and method

Printed wiring board structure with z-axis interconnections

Conductive substructures of a multilayered laminate

Zero insertion force compliant pin contact and assembly