James Raymond Maliclic Baello

Person

Mabalacat, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device topside cooling
- Patent number 11,742,266
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flip chip solder joint capsules
- Patent number 11,600,498
- Issue date Mar 7, 2023
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip integrated circuit packages with spacers
- Patent number 10,593,640
- Issue date Mar 17, 2020
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal bumps with flange
- Patent number 9,564,410
- Issue date Feb 7, 2017
- Texas Instruments Incorporated
- Floro Lopez Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making a flip-chip assembly with bond fingers
- Patent number 9,219,052
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with bond fingers
- Patent number 8,766,461
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Raymond Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding a solder bump to a lead using compression and retraction fo...
- Patent number 8,381,967
- Issue date Feb 26, 2013
- Texas Instruments Incorporated
- Mutsumi Masumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assembly for improved device warpage and solder ball...
- Patent number 7,462,943
- Issue date Dec 9, 2008
- Texas Instruments Incorporated
- Patricio A Ancheta, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly for improved device warpage and solder ball...
- Patent number 7,244,636
- Issue date Jul 17, 2007
- Texas Instruments Incorporated
- Patricio V. Ancheta, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE TOPSIDE COOLING
- Publication number 20230395471
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20230187223
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
- Publication number 20220122940
- Publication date Apr 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES
- Publication number 20210202269
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE TOPSIDE COOLING
- Publication number 20210183751
- Publication date Jun 17, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP INTEGRATED CIRCUIT PACKAGES WITH SPACERS
- Publication number 20190326245
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING METAL BUMPS WITH FLANGE
- Publication number 20170012012
- Publication date Jan 12, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Floro Lopez Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS
- Publication number 20140248746
- Publication date Sep 4, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BOND FINGERS
- Publication number 20140197534
- Publication date Jul 17, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Raymond Maldan Partosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die detection and reference die wafermap alignment
- Publication number 20080188016
- Publication date Aug 7, 2008
- Texas Instruments, Inc.
- Melanie Aquitania Pare
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Assembly for Improved Device Warpage and Solder Ball...
- Publication number 20080142949
- Publication date Jun 19, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Patricio A. Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly for improved device warpage and solder ball...
- Publication number 20070085171
- Publication date Apr 19, 2007
- Patricio V. Ancheta
- H01 - BASIC ELECTRIC ELEMENTS

James Raymond Maliclic Baello

Person

Patents Grantslast 30 patents

Electronic device topside cooling

Semiconductor package with flip chip solder joint capsules

Flip chip integrated circuit packages with spacers

Semiconductor devices having metal bumps with flange

Making a flip-chip assembly with bond fingers

Substrate with bond fingers

Bonding a solder bump to a lead using compression and retraction fo...

Semiconductor assembly for improved device warpage and solder ball...

Semiconductor assembly for improved device warpage and solder ball...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE TOPSIDE COOLING

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

SEMICONDUCTOR PACKAGE WITH FLIP CHIP SOLDER JOINT CAPSULES

ELECTRONIC DEVICE TOPSIDE COOLING

FLIP CHIP INTEGRATED CIRCUIT PACKAGES WITH SPACERS

SEMICONDUCTOR DEVICES HAVING METAL BUMPS WITH FLANGE

MAKING A FLIP-CHIP ASSEMBLY WITH BOND FINGERS

SUBSTRATE WITH BOND FINGERS

Die detection and reference die wafermap alignment

Semiconductor Assembly for Improved Device Warpage and Solder Ball...

Semiconductor assembly for improved device warpage and solder ball...