Membership
Tour
Register
Log in
James S. Papanu
Follow
Person
San Rafael, CA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Automatic kerf offset mapping and correction system for laser dicing
Patent number
11,901,232
Issue date
Feb 13, 2024
Applied Materials, Inc.
Karthik Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser scribing trench opening control in wafer dicing using hybrid...
Patent number
11,854,888
Issue date
Dec 26, 2023
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Water soluble organic-inorganic hybrid mask formulations and their...
Patent number
11,764,061
Issue date
Sep 19, 2023
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrostatic chuck with reduced current leakage for hybrid laser s...
Patent number
11,600,492
Issue date
Mar 7, 2023
Applied Materials, Inc.
Sai Abhinand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
Patent number
11,217,536
Issue date
Jan 4, 2022
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Water soluble organic-inorganic hybrid mask formulations and their...
Patent number
11,211,247
Issue date
Dec 28, 2021
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-absorbing mask for hybrid laser scribing and plasma etch wafe...
Patent number
11,158,540
Issue date
Oct 26, 2021
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using a spatially multi-focused laser...
Patent number
11,011,424
Issue date
May 18, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using a uniform rotating beam laser sc...
Patent number
10,903,121
Issue date
Jan 26, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using a multiple pass laser scribing p...
Patent number
10,535,561
Issue date
Jan 14, 2020
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
Patent number
9,972,575
Issue date
May 15, 2018
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using a rotating beam laser scribing p...
Patent number
9,852,997
Issue date
Dec 26, 2017
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Etch mask for hybrid laser scribing and plasma etch wafer singulati...
Patent number
9,793,132
Issue date
Oct 17, 2017
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer coating
Patent number
9,768,014
Issue date
Sep 19, 2017
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
UV-cure pre-treatment of carrier film for wafer dicing using hybrid...
Patent number
9,601,375
Issue date
Mar 21, 2017
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Water soluble mask formation by dry film lamination
Patent number
9,583,375
Issue date
Feb 28, 2017
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Water soluble mask formation by dry film vacuum lamination for lase...
Patent number
9,443,765
Issue date
Sep 13, 2016
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of outgassing a mask material deposited over a workpiece in...
Patent number
9,412,619
Issue date
Aug 9, 2016
Applied Materials, Inc.
Prabhat Kumar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using a line shaped laser beam profile...
Patent number
9,355,907
Issue date
May 31, 2016
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing wafers having solder bumps on wafer backside
Patent number
9,343,366
Issue date
May 17, 2016
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Screen print mask for laser scribe and plasma etch wafer dicing pro...
Patent number
9,312,177
Issue date
Apr 12, 2016
Applied Materials, Inc.
Prabhat Kumar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of wafer dicing using hybrid laser scribing and plasma etch...
Patent number
9,299,611
Issue date
Mar 29, 2016
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using an adaptive optics-controlled la...
Patent number
9,281,244
Issue date
Mar 8, 2016
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dicing processes for thin wafers with bumps on wafer backside
Patent number
9,275,902
Issue date
Mar 1, 2016
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using a bessel beam shaper laser scrib...
Patent number
9,245,803
Issue date
Jan 26, 2016
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Maskless hybrid laser scribing and plasma etching wafer dicing process
Patent number
9,209,084
Issue date
Dec 8, 2015
Applied Materials, Inc.
Wei-Sheng Lei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using a phase modulated laser beam pro...
Patent number
9,196,536
Issue date
Nov 24, 2015
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hybrid wafer dicing approach using laser scribing process based on...
Patent number
9,177,861
Issue date
Nov 3, 2015
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of die singulation using laser ablation and induction of int...
Patent number
9,165,832
Issue date
Oct 20, 2015
Applied Materials, Inc.
James S. Papanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vacuum lamination of polymeric dry films for wafer dicing using hyb...
Patent number
9,159,624
Issue date
Oct 13, 2015
Applied Materials, Inc.
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
Publication number
20240079273
Publication date
Mar 7, 2024
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER S...
Publication number
20230187215
Publication date
Jun 15, 2023
Applied Materials, Inc.
Sai Abhinand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
Publication number
20230100863
Publication date
Mar 30, 2023
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20220181142
Publication date
Jun 9, 2022
Applied Materials, Inc.
Chien-Kang HSIUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR...
Publication number
20220076944
Publication date
Mar 10, 2022
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING
Publication number
20210398853
Publication date
Dec 23, 2021
Applied Materials, Inc.
Karthik Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
Publication number
20210398854
Publication date
Dec 23, 2021
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR...
Publication number
20210242014
Publication date
Aug 5, 2021
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...
Publication number
20210233816
Publication date
Jul 29, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER S...
Publication number
20210175086
Publication date
Jun 10, 2021
Applied Materials, Inc.
Sai Abhinand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SC...
Publication number
20210050263
Publication date
Feb 18, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...
Publication number
20210043515
Publication date
Feb 11, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...
Publication number
20190279902
Publication date
Sep 12, 2019
Applied Materials, Inc.
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LIGHT-ABSORBING MASK FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFE...
Publication number
20180342422
Publication date
Nov 29, 2018
Applied Materials, Inc.
Wenguang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
Publication number
20180226355
Publication date
Aug 9, 2018
Applied Materials, Inc.
JUNGRAE PARK
A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A ROTATING BEAM LASER SCRIBING P...
Publication number
20170278801
Publication date
Sep 28, 2017
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
Publication number
20170256500
Publication date
Sep 7, 2017
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID...
Publication number
20160315009
Publication date
Oct 27, 2016
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING AN ADAPTIVE OPTICS-CONTROLLED LA...
Publication number
20160086851
Publication date
Mar 24, 2016
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF OUTGASSING A MASK MATERIAL DEPOSITED OVER A WORKPIECE IN...
Publication number
20160049313
Publication date
Feb 18, 2016
Applied Materials, Inc.
PRABHAT KUMAR
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
DICING WAFERS HAVING SOLDER BUMPS ON WAFER BACKSIDE
Publication number
20150303111
Publication date
Oct 22, 2015
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WATER SOLUBLE MASK FORMATION BY DRY FILM LAMINATION
Publication number
20150294892
Publication date
Oct 15, 2015
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING COLLIMATED LASER SCRIBING PROCES...
Publication number
20150287638
Publication date
Oct 8, 2015
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DICING PROCESSES FOR THIN WAFERS WITH BUMPS ON WAFER BACKSIDE
Publication number
20150279739
Publication date
Oct 1, 2015
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BAKING TOOL FOR IMPROVED WAFER COATING PROCESS
Publication number
20150255346
Publication date
Sep 10, 2015
Jungrae PARK
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPROACHES FOR CLEANING A WAFER DURING HYBRID LASER SCRIBING AND PL...
Publication number
20150255349
Publication date
Sep 10, 2015
James Matthew Holden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRI...
Publication number
20150243559
Publication date
Aug 27, 2015
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPROVED WAFER COATING
Publication number
20150221505
Publication date
Aug 6, 2015
Jungrae Park
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
WATER SOLUBLE MASK FORMATION BY DRY FILM VACUUM LAMINATION FOR LASE...
Publication number
20150214111
Publication date
Jul 30, 2015
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH W...
Publication number
20150214109
Publication date
Jul 30, 2015
Wei-Sheng Lei
H01 - BASIC ELECTRIC ELEMENTS