James Speidell

Person

Poughquag, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature Bi-CMOS compatible process for MEMS RF resonators a...
- Patent number 8,269,291
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,237,271
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature Bi-CMOS compatible process for MEMS RF resonators a...
- Patent number 7,943,412
- Issue date May 17, 2011
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fill head for injection molding of solder
- Patent number 7,784,664
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotational fill techniques for injection molding of solder
- Patent number 7,784,673
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal mold for injection molding of solder
- Patent number 7,694,869
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bonding material fill techniques
- Patent number 7,669,748
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Global vacuum injection molded solder system and method
- Patent number 7,497,366
- Issue date Mar 3, 2009
- International Business Machines Corporation
- S. Jay Chey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflective spatial light modulator array including a light blocking...
- Patent number 7,468,766
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Rotational fill techniques for injection molding of solder
- Patent number 7,416,104
- Issue date Aug 26, 2008
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bonding material fill techniques
- Patent number 7,410,090
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fill head for injection molding of solder
- Patent number 7,410,092
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Precision and apertures for lithographic systems
- Patent number 7,029,830
- Issue date Apr 18, 2006
- International Business Machines Corporation
- Steven Alan Cordes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for thermal management of integrated circuits
- Patent number 6,893,902
- Issue date May 17, 2005
- International Business Machines Corporation
- Michael James Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid molds for molten solder screening process
- Patent number 6,832,747
- Issue date Dec 21, 2004
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guides lithographically fabricated on semiconductor devices
- Patent number 6,798,953
- Issue date Sep 28, 2004
- International Business Machines Corporation
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Grant
Multimode planar spectrographs for wavelength demultiplexing and me...
- Patent number 6,657,723
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Mitchell S. Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Maskless method and system for creating a dual-domain pattern on a...
- Patent number 6,654,089
- Issue date Nov 25, 2003
- International Business Machines Corporation
- Praveen Chaudhari
- G02 - OPTICS
Information Patent Grant
Method and apparatus for thermal management of integrated circuits
- Patent number 6,614,109
- Issue date Sep 2, 2003
- International Business Machines Corporation
- Michael James Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self alignment of substrates by magnetic alignment
- Patent number 6,583,847
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Alessandro C. Callegari
- G02 - OPTICS
Information Patent Grant
Method for constructing an encapsulated MEMS band-pass filter for i...
- Patent number 6,429,755
- Issue date Aug 6, 2002
- International Business Machines Corporation
- James L. Speidell
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for forming three-dimensional circuitization and circuits fo...
- Patent number 6,426,241
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflective spatial light modulator array
- Patent number 6,424,388
- Issue date Jul 23, 2002
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Encapsulated MEMS band-pass filter for integrated circuits and meth...
- Patent number 6,399,406
- Issue date Jun 4, 2002
- International Business Machines Corporation
- Kevin K. Chan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid molds for molten solder screening process
- Patent number 6,390,439
- Issue date May 21, 2002
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Int...
- Publication number 20210351043
- Publication date Nov 11, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...
- Publication number 20120270351
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature BI-CMOS Compatible Process For MEMS RF Resonators a...
- Publication number 20110109405
- Publication date May 12, 2011
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low temperature bi-CMOS compatible process for MEMS RF resonators a...
- Publication number 20090108381
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROTATIONAL FILL TECHNIQUES FOR INJECTION MOLDING OF SOLDER
- Publication number 20090008057
- Publication date Jan 8, 2009
- International Business Machines Corp.
- Steven A. CORDES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20080315409
- Publication date Dec 25, 2008
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL HEAD FOR INJECTION MOLDING OF SOLDER
- Publication number 20080302502
- Publication date Dec 11, 2008
- International Business Machines Corp.
- STEVEN A. CORDES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES
- Publication number 20080272177
- Publication date Nov 6, 2008
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rotational fill techniques for injection molding of solder
- Publication number 20070246515
- Publication date Oct 25, 2007
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Universal mold for injection molding of solder
- Publication number 20070246516
- Publication date Oct 25, 2007
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fill head for injection molding of solder
- Publication number 20070246518
- Publication date Oct 25, 2007
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive bonding material fill techniques
- Publication number 20070246511
- Publication date Oct 25, 2007
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLOBAL VACUUM INJECTION MOLDED SOLDER SYSTEM AND METHOD
- Publication number 20070246853
- Publication date Oct 25, 2007
- International Business Machines Corporation
- S. JAY CHEY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF INTEGRATED CIRCUITS
- Publication number 20040262745
- Publication date Dec 30, 2004
- Michael James Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMODE PLANAR SPECTROGRAPHS FOR WAVELENGTH DEMULTIPLEXING AND ME...
- Publication number 20030197862
- Publication date Oct 23, 2003
- Mitchell S. Cohen
- G02 - OPTICS
Information Patent Application
Precision and apertures for lithographic systems
- Publication number 20030049569
- Publication date Mar 13, 2003
- Steven Alan Cordes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Self alignment of substrates
- Publication number 20020191143
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Alessandro C. Callegari
- G02 - OPTICS
Information Patent Application
Maskless method and system for creating a dual-domain pattern on a...
- Publication number 20020163612
- Publication date Nov 7, 2002
- International Business Machines Corporation
- Praveen Chaudhari
- G02 - OPTICS
Information Patent Application
Hybrid molds for molten solder screening process
- Publication number 20020125402
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Steven A. Cordes
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and apparatus for thermal management of integrated circuits
- Publication number 20020113289
- Publication date Aug 22, 2002
- Michael James Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming three-dimensional circuitization and circuits fo...
- Publication number 20020113324
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated MEMS band-pass filter for integrated circuits and meth...
- Publication number 20010055864
- Publication date Dec 27, 2001
- IBM Corporation
- Kevin K. Chan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Encapsulated mems band-pass filter for integrated circuits
- Publication number 20010020878
- Publication date Sep 13, 2001
- James L. Speidell
- H03 - BASIC ELECTRONIC CIRCUITRY

James Speidell

Person

Patents Grantslast 30 patents

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Direct edge connection for multi-chip integrated circuits

Low temperature Bi-CMOS compatible process for MEMS RF resonators a...

Direct edge connection for multi-chip integrated circuits

Low temperature Bi-CMOS compatible process for MEMS RF resonators a...

Fill head for injection molding of solder

Rotational fill techniques for injection molding of solder

Universal mold for injection molding of solder

Conductive bonding material fill techniques

Global vacuum injection molded solder system and method

Reflective spatial light modulator array including a light blocking...

Rotational fill techniques for injection molding of solder

Conductive bonding material fill techniques

Fill head for injection molding of solder

Precision and apertures for lithographic systems

Method and apparatus for thermal management of integrated circuits

Hybrid molds for molten solder screening process

Guides lithographically fabricated on semiconductor devices

Multimode planar spectrographs for wavelength demultiplexing and me...

Maskless method and system for creating a dual-domain pattern on a...

Method and apparatus for thermal management of integrated circuits

Self alignment of substrates by magnetic alignment

Method for constructing an encapsulated MEMS band-pass filter for i...

Method for forming three-dimensional circuitization and circuits fo...

Reflective spatial light modulator array

Encapsulated MEMS band-pass filter for integrated circuits and meth...

Hybrid molds for molten solder screening process

Patents Applicationslast 30 patents

Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Int...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...

Direct Edge Connection for Multi-Chip Integrated Circuits

Low Temperature BI-CMOS Compatible Process For MEMS RF Resonators a...

Low temperature bi-CMOS compatible process for MEMS RF resonators a...

ROTATIONAL FILL TECHNIQUES FOR INJECTION MOLDING OF SOLDER

DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS

FILL HEAD FOR INJECTION MOLDING OF SOLDER

CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES

Rotational fill techniques for injection molding of solder

Universal mold for injection molding of solder

Fill head for injection molding of solder

Conductive bonding material fill techniques

GLOBAL VACUUM INJECTION MOLDED SOLDER SYSTEM AND METHOD

METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF INTEGRATED CIRCUITS

MULTIMODE PLANAR SPECTROGRAPHS FOR WAVELENGTH DEMULTIPLEXING AND ME...

Precision and apertures for lithographic systems

Self alignment of substrates

Maskless method and system for creating a dual-domain pattern on a...

Hybrid molds for molten solder screening process

Method and apparatus for thermal management of integrated circuits

Method for forming three-dimensional circuitization and circuits fo...

Encapsulated MEMS band-pass filter for integrated circuits and meth...

Encapsulated mems band-pass filter for integrated circuits