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James T. Huneke
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San Diego, CA, US
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last 30 patents
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Patent Grant
Materials and methods for stress reduction in semiconductor wafer p...
Patent number
8,710,682
Issue date
Apr 29, 2014
Designer Molecules Inc, Inc.
Stephen M Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Materials and methods for stress reduction in semiconductor wafer p...
Patent number
8,415,812
Issue date
Apr 9, 2013
Designer Molecules, Inc.
Stephen M Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,550,825
Issue date
Jun 23, 2009
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,312,534
Issue date
Dec 25, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
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Patent Application
HEAT AND MOISTURE RESISTANT ANAEROBIC ADHESIVES AND SEALANTS
Publication number
20140275413
Publication date
Sep 18, 2014
DESIGNER MOLECULES, INC.
STEPHEN M. DERSHEM
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER P...
Publication number
20130228901
Publication date
Sep 5, 2013
DESIGNER MOLECULES, INC.
Stephen M. Dershem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER P...
Publication number
20110049731
Publication date
Mar 3, 2011
DESIGNER MOLECULES, INC.
Stephen M. Dershem
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials
Publication number
20070278683
Publication date
Dec 6, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Interlayer dielectric and pre-applied die attach adhesive materials
Publication number
20050008832
Publication date
Jan 13, 2005
Benedicto de los Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...