James Vernon Ellerson

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,920,125
- Issue date Jul 6, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,859,470
- Issue date Jan 12, 1999
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electronic package assembly with protective encaps...
- Patent number 5,669,137
- Issue date Sep 23, 1997
- International Business Machines Corporation
- James Vernon Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of a carrier substrate and a semiconductor device
- Patent number 5,553,769
- Issue date Sep 10, 1996
- International Business Machine Corporation
- James V. Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package assembly with protective encapsulant material on...
- Patent number 5,469,333
- Issue date Nov 21, 1995
- International Business Machines Corporation
- James V. Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic package assembly with protective enc...
- Patent number 5,414,928
- Issue date May 16, 1995
- International Business Machines Corporation
- Barry A. Bonitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for selectively etching a plastic encapsulatin...
- Patent number 5,252,179
- Issue date Oct 12, 1993
- International Business Machines Corporation
- James V. Ellerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing circuit lines on a substrate
- Patent number 4,690,833
- Issue date Sep 1, 1987
- International Business Machines Corporation
- William A. Donson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James Vernon Ellerson

Person

Patents Grantslast 30 patents

Interconnection of a carrier substrate and a semiconductor device

Interconnection of a carrier substrate and a semiconductor device

Method of making electronic package assembly with protective encaps...

Interconnection of a carrier substrate and a semiconductor device

Electronic package assembly with protective encapsulant material on...

Method of making an electronic package assembly with protective enc...

Apparatus and method for selectively etching a plastic encapsulatin...

Providing circuit lines on a substrate