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James W. Fuller JR.
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Endicott, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming a substructure of a multilayered laminate
Patent number
6,832,436
Issue date
Dec 21, 2004
International Business Machines Corporation
Donald O. Anstrom
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuitized substrate assembly and method of making same
Patent number
6,809,269
Issue date
Oct 26, 2004
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit boards for electronic device packages having glass...
Patent number
6,781,064
Issue date
Aug 24, 2004
International Business Machines Corporation
Bernd K. Appelt
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Article exhibiting enhanced adhesion between a dielectric substrate...
Patent number
6,529,379
Issue date
Mar 4, 2003
International Business Machines Corporation
James W. Fuller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive substructures of a multilayered laminate
Patent number
6,407,341
Issue date
Jun 18, 2002
International Business Machines Corporation
Donald O. Anstrom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device packages having glass free non conductive layers
Patent number
5,981,880
Issue date
Nov 9, 1999
International Business Machines Corporation
Bernd Karl-Heinz Appelt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure for constraining the flow of incapsulant appli...
Patent number
5,869,356
Issue date
Feb 9, 1999
International Business Machines Corporation
James W. Fuller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for constraining the flow of encapsulant applied to an I/...
Patent number
5,784,260
Issue date
Jul 21, 1998
International Business Machines Corporation
James W. Fuller
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of making circuitized substrate assembly
Publication number
20060123626
Publication date
Jun 15, 2006
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20060046462
Publication date
Mar 2, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20060040426
Publication date
Feb 23, 2006
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate, method of making same and information handli...
Publication number
20050074924
Publication date
Apr 7, 2005
Endicott Interconnect Technologies, Inc.
Timothy Antesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Information handling system utilizing circuitized substrate
Publication number
20050023035
Publication date
Feb 3, 2005
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate assembly and method of making same
Publication number
20050011670
Publication date
Jan 20, 2005
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic card
Publication number
20040242270
Publication date
Dec 2, 2004
Endicott Interconnect Technologies, Inc.
Ashwinkumar Bhatt
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Circuitized substrate assembly and method of making same
Publication number
20040177998
Publication date
Sep 16, 2004
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuitized substrate assembly and method of making same
Publication number
20040118596
Publication date
Jun 24, 2004
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Information handling system utilizing circuitized substrate
Publication number
20040118598
Publication date
Jun 24, 2004
Endicott Interconnect Technologies, Inc.
James W. Fuller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Conductive substructures of a multilayered laminate
Publication number
20020100613
Publication date
Aug 1, 2002
International Business Machines Corporation
Donald O. Anstrom
H01 - BASIC ELECTRIC ELEMENTS