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Jamie Hulan
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Ottawa, CA
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last 30 patents
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Patent Grant
Supplemental heat conduction path for card to chassis heat dissipation
Patent number
6,873,528
Issue date
Mar 29, 2005
Dy 4 Systems Ltd.
Jamie Hulan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Supplemental heat conduction path for card to chassis heat dissipation
Publication number
20030223197
Publication date
Dec 4, 2003
Dy-04 Systems Ltd.
Jamie Hulan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR