Jamil Wakil

Person

Buchanan Dam, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming an overmolded dual in-line memory module cooling...
- Patent number 8,900,503
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Michael A. Boraas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced thermal management of 3-D stacked die packaging
- Patent number 8,299,608
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a flip-chip package
- Patent number 8,037,594
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Jeffrey T. Coffin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and method for reliability evaluation of FCPBGA substrate...
- Patent number 7,982,475
- Issue date Jul 19, 2011
- International Business Machines Corporation
- David J Russell
- G01 - MEASURING TESTING
Information Patent Grant
Segmentation of a die stack for 3D packaging thermal management
- Patent number 7,928,562
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for distributing power in electronic circuits and comput...
- Patent number 7,698,114
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Hendrik F. Hamann
- G01 - MEASURING TESTING
Information Patent Grant
Optimized thermally conductive plate and attachment method for enha...
- Patent number 7,489,512
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized thermally conductive plate and attachment method for enha...
- Patent number 7,319,591
- Issue date Jan 15, 2008
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for measuring temperature and power distribution...
- Patent number 7,167,806
- Issue date Jan 23, 2007
- International Business Machines Corporation
- Hendrik F. Hamann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package with heat spreader allowing multiple heat sink at...
- Patent number 6,829,144
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Randall J. Stutzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for multi-processor shared-memory system
- Patent number 6,793,123
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink structure with pyramidic and base-plate cut-outs
- Patent number 6,622,786
- Issue date Sep 23, 2003
- International Business Machines Corporation
- Varaprasad V. Calmidi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Packaging for multi-processor shared-memory system
- Patent number 6,541,847
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE
- Publication number 20150033550
- Publication date Feb 5, 2015
- LENOVO (SINGAPORE) PTE. LTD.
- MICHAEL A. BORAAS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRAN...
- Publication number 20130168068
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Zhen Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Overmolded Dual In-Line Memory Module Cooling Structure
- Publication number 20130074339
- Publication date Mar 28, 2013
- International Business Machines Corporation
- Michael A. Boraas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
- Publication number 20120007229
- Publication date Jan 12, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT
- Publication number 20100019377
- Publication date Jan 28, 2010
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP
- Publication number 20090045501
- Publication date Feb 19, 2009
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized Thermally Conductive Plate and Attachment Method for Enha...
- Publication number 20080303021
- Publication date Dec 11, 2008
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...
- Publication number 20070236890
- Publication date Oct 11, 2007
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR RELIABILITY EVALUATION OF FCPBGA SUBSTRATE...
- Publication number 20070202616
- Publication date Aug 30, 2007
- International Business Machines Corporation
- David J Russell
- G01 - MEASURING TESTING
Information Patent Application
Techniques for distributing power in electronic circuits and comput...
- Publication number 20070098037
- Publication date May 3, 2007
- International Business Machines Corporation
- Hendrik F. Hamann
- G01 - MEASURING TESTING
Information Patent Application
OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...
- Publication number 20060268521
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for measuring temperature and power distributions...
- Publication number 20060039114
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Hendrik F. Hamann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging for multi-processor shared-memory system
- Publication number 20030146268
- Publication date Aug 7, 2003
- Harm P. Hofstee
- H01 - BASIC ELECTRIC ELEMENTS

Jamil Wakil

Person

Patents Grantslast 30 patents

Method of forming an overmolded dual in-line memory module cooling...

Enhanced thermal management of 3-D stacked die packaging

Method of forming a flip-chip package

Structure and method for reliability evaluation of FCPBGA substrate...

Segmentation of a die stack for 3D packaging thermal management

Techniques for distributing power in electronic circuits and comput...

Optimized thermally conductive plate and attachment method for enha...

Optimized thermally conductive plate and attachment method for enha...

Method and system for measuring temperature and power distribution...

Flip chip package with heat spreader allowing multiple heat sink at...

Packaging for multi-processor shared-memory system

Heat sink structure with pyramidic and base-plate cut-outs

Packaging for multi-processor shared-memory system

Patents Applicationslast 30 patents

OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE

THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRAN...

Overmolded Dual In-Line Memory Module Cooling Structure

ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP

Optimized Thermally Conductive Plate and Attachment Method for Enha...

OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...

STRUCTURE AND METHOD FOR RELIABILITY EVALUATION OF FCPBGA SUBSTRATE...

Techniques for distributing power in electronic circuits and comput...

OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHA...

Method and system for measuring temperature and power distributions...

Packaging for multi-processor shared-memory system