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Jamin Ling
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Westboro, MA, US
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last 30 patents
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Patent Grant
Method of forming planarized multilevel metallization in an integra...
Patent number
6,191,484
Issue date
Feb 20, 2001
STMicroelectronics, Inc.
Kuei-Wu Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming planarized multilevel metallization in an integr...
Patent number
6,180,509
Issue date
Jan 30, 2001
STMicroelectronics, Inc.
Kuei-Wu Huang
H01 - BASIC ELECTRIC ELEMENTS