Jan Gulpen

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a plurality of packaged semiconductor devices
- Patent number 10,431,476
- Issue date Oct 1, 2019
- NXP B.V.
- Jetse de Witte
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded QFN package and method of making
- Patent number 10,096,555
- Issue date Oct 9, 2018
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded QFN package and method of making
- Patent number 9,653,414
- Issue date May 16, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single inline no-lead semiconductor package
- Patent number 9,379,071
- Issue date Jun 28, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,679,963
- Issue date Mar 25, 2014
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A PLURALITY OF PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20180301353
- Publication date Oct 18, 2018
- NXP B.V.
- Jetse de Witte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20170372988
- Publication date Dec 28, 2017
- NXP B.V.
- ROELF GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED QFN PACKAGE AND METHOD OF MAKING
- Publication number 20170213797
- Publication date Jul 27, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20170103939
- Publication date Apr 13, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED QFN PACKAGE AND METHOD OF MAKING
- Publication number 20170025369
- Publication date Jan 26, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20150303156
- Publication date Oct 22, 2015
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of making a plurality of packaged semiconductor devices

Wafer level chip scale semiconductor package

Shielded QFN package and method of making

Shielded QFN package and method of making

Single inline no-lead semiconductor package

Fan-out chip scale package

Fan-out chip scale package

Patents Applicationslast 30 patents

METHOD OF MAKING A PLURALITY OF PACKAGED SEMICONDUCTOR DEVICES

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

SHIELDED QFN PACKAGE AND METHOD OF MAKING

ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE

SHIELDED QFN PACKAGE AND METHOD OF MAKING

SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE

FAN-OUT CHIP SCALE PACKAGE

FAN-OUT CHIP SCALE PACKAGE