Jan Krajniak

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
- Publication number 20200273811
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...
- Publication number 20200273768
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200227332
- Publication date Jul 16, 2020
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
- Publication number 20180324955
- Publication date Nov 8, 2018
- Intel Corporation
- Mohit SOOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...
- Publication number 20180068926
- Publication date Mar 8, 2018
- Intel Corporation
- JAN KRAJNIAK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
- Publication number 20170053858
- Publication date Feb 23, 2017
- Intel Corporation
- Jan Krajniak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Jan Krajniak

Person

Patents Grantslast 30 patents

Microelectronic structures including bridges

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE

CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS

ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...

SUBSTRATE ON SUBSTRATE PACKAGE