Jan Richter

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Solid body and multi-component arrangement
- Patent number 12,211,702
- Issue date Jan 28, 2025
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wafers with modification lines of defined orie...
- Patent number 12,159,805
- Issue date Dec 3, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for applying pressure to stress-producing layers...
- Patent number 12,151,314
- Issue date Nov 26, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating wafers from donor substrates
- Patent number 12,030,216
- Issue date Jul 9, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating a solid body
- Patent number 11,996,331
- Issue date May 28, 2024
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing the thickness of solid-state layers provided wi...
- Patent number 11,869,810
- Issue date Jan 9, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,833,617
- Issue date Dec 5, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser conditioning of solid bodies using prior knowledge from previ...
- Patent number 11,822,307
- Issue date Nov 21, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production facility for separating wafers from donor substrates
- Patent number 11,787,083
- Issue date Oct 17, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nonplanar wafer and method for producing a nonplanar wafer
- Patent number 11,786,995
- Issue date Oct 17, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating solid body layers from composite structures m...
- Patent number 11,772,201
- Issue date Oct 3, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a layer of solid material
- Patent number 11,699,616
- Issue date Jul 11, 2023
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for thinning solid-body layers provided with components
- Patent number 11,664,277
- Issue date May 30, 2023
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a detachment area in a solid body
- Patent number 11,527,441
- Issue date Dec 13, 2022
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Splitting of a solid using conversion of material
- Patent number 11,407,066
- Issue date Aug 9, 2022
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for modifying substrates based on crystal lattice dislocatio...
- Patent number 11,309,191
- Issue date Apr 19, 2022
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating thin layers of solid material from a solid body
- Patent number 11,201,081
- Issue date Dec 14, 2021
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined laser treatment of a solid body to be split
- Patent number 11,130,200
- Issue date Sep 28, 2021
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for producing planar modifications in solid bodies
- Patent number 11,059,202
- Issue date Jul 13, 2021
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer production method
- Patent number 11,004,723
- Issue date May 11, 2021
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in the edge region of a donor substrate,...
- Patent number 10,994,442
- Issue date May 4, 2021
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for thinning solid body layers provided with components
- Patent number 10,978,311
- Issue date Apr 13, 2021
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined wafer production method with a receiving layer having holes
- Patent number 10,960,574
- Issue date Mar 30, 2021
- Siltectra GmbH
- Jan Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based separation method
- Patent number 10,930,560
- Issue date Feb 23, 2021
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer hybrid material for use in a splitting method
- Patent number 10,858,495
- Issue date Dec 8, 2020
- Siltectra GmbH
- Christian Beyer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for the material-saving production of wafers and processing...
- Patent number 10,843,380
- Issue date Nov 24, 2020
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wafer production method with a multi-component receiving l...
- Patent number 10,707,068
- Issue date Jul 7, 2020
- Siltectra GmbH
- Jan Richter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing a Detachment Region in a Solid-state Body
- Publication number 20240058899
- Publication date Feb 22, 2024
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Wafers from Donor Substrates
- Publication number 20230390961
- Publication date Dec 7, 2023
- SILTECTRA GMBH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20230307286
- Publication date Sep 28, 2023
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A SOLID BODY
- Publication number 20230106978
- Publication date Apr 6, 2023
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A SOLID-STATE LAYER FROM A SOLID-STATE MATERIAL
- Publication number 20210299910
- Publication date Sep 30, 2021
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Detachment Area in a Solid Body
- Publication number 20210265215
- Publication date Aug 26, 2021
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20210225694
- Publication date Jul 22, 2021
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Thinning Solid-Body Layers Provided with Components
- Publication number 20210225709
- Publication date Jul 22, 2021
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid Body and Multi-Component Arrangement
- Publication number 20210225659
- Publication date Jul 22, 2021
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE
- Publication number 20210213643
- Publication date Jul 15, 2021
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Reducing the Thickness of Solid-State Layers Provided wi...
- Publication number 20210197314
- Publication date Jul 1, 2021
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20210053148
- Publication date Feb 25, 2021
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Treating a Solid Layer Bonded to a Carrier Substrate
- Publication number 20210039279
- Publication date Feb 11, 2021
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Short Subcritical Cracks in Solid Bodies
- Publication number 20200398381
- Publication date Dec 24, 2020
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Wafers with Modification Lines of Defined Orie...
- Publication number 20200388538
- Publication date Dec 10, 2020
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production Facility for Separating Wafers from Donor Substrates
- Publication number 20200254650
- Publication date Aug 13, 2020
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and Method for Applying Pressure to Stress-Producing Layers...
- Publication number 20200215648
- Publication date Jul 9, 2020
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Production Method
- Publication number 20200185267
- Publication date Jun 11, 2020
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Thinning Solid Body Layers Provided with Components
- Publication number 20200066542
- Publication date Feb 27, 2020
- SILTECTRA GMBH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Modifying Substrates Based on Crystal Lattice Dislocatio...
- Publication number 20200051831
- Publication date Feb 13, 2020
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Thin Layers of Solid Material from a Solid Body
- Publication number 20200006119
- Publication date Jan 2, 2020
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR PRODUCING PLANAR MODIFICATIONS IN SOLID BODIES
- Publication number 20190366586
- Publication date Dec 5, 2019
- SILTECTRA GMBH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Solid Body Layers from Composite Structures M...
- Publication number 20190337100
- Publication date Nov 7, 2019
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...
- Publication number 20190302725
- Publication date Oct 3, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Combined wafer production method with laser treatment and temperatu...
- Publication number 20190237359
- Publication date Aug 1, 2019
- Siltectra, GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20190218131
- Publication date Jul 18, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED LASER TREATMENT OF A SOLID BODY TO BE SPLIT
- Publication number 20190099838
- Publication date Apr 4, 2019
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRODUCTION MEHTOD FOR SEPARATING A NUMBER OF THIN LAYERS O...
- Publication number 20190096746
- Publication date Mar 28, 2019
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER HYBRID MATERIAL FOR USE IN A SPLITTING METHOD
- Publication number 20190071552
- Publication date Mar 7, 2019
- SILTECTRA GMBH
- Christian BEYER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Jan Richter

Person

Patents Grantslast 30 patents

Solid body and multi-component arrangement

Method for producing wafers with modification lines of defined orie...

Device and method for applying pressure to stress-producing layers...

Method for forming a crack in an edge region of a donor substrate

Method for separating wafers from donor substrates

Method for separating a solid body

Method for reducing the thickness of solid-state layers provided wi...

Splitting of a solid using conversion of material

Laser conditioning of solid bodies using prior knowledge from previ...

Production facility for separating wafers from donor substrates

Nonplanar wafer and method for producing a nonplanar wafer

Method for separating solid body layers from composite structures m...

Parent substrate, wafer composite and methods of manufacturing crys...

Method for producing a layer of solid material

Method for thinning solid-body layers provided with components

Method for producing a detachment area in a solid body

Method of treating a solid layer bonded to a carrier substrate

Splitting of a solid using conversion of material

Method for modifying substrates based on crystal lattice dislocatio...

Method for separating thin layers of solid material from a solid body

Combined laser treatment of a solid body to be split

Method and device for producing planar modifications in solid bodies

Wafer production method

Method for forming a crack in the edge region of a donor substrate,...

Method for thinning solid body layers provided with components

Combined wafer production method with a receiving layer having holes

Laser-based separation method

Polymer hybrid material for use in a splitting method

Method for the material-saving production of wafers and processing...

Combined wafer production method with a multi-component receiving l...

Patents Applicationslast 30 patents

Method for Producing a Detachment Region in a Solid-state Body

Method for Separating Wafers from Donor Substrates

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

Method for Producing a Layer of Solid Material

METHOD FOR SEPARATING A SOLID BODY

METHOD FOR SEPARATING A SOLID-STATE LAYER FROM A SOLID-STATE MATERIAL

Method for Producing a Detachment Area in a Solid Body

Method for Producing a Layer of Solid Material

Method for Thinning Solid-Body Layers Provided with Components

Solid Body and Multi-Component Arrangement

METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE

Method for Reducing the Thickness of Solid-State Layers Provided wi...

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

Method of Treating a Solid Layer Bonded to a Carrier Substrate

Method for Producing Short Subcritical Cracks in Solid Bodies

Method for Producing Wafers with Modification Lines of Defined Orie...

Production Facility for Separating Wafers from Donor Substrates

Device and Method for Applying Pressure to Stress-Producing Layers...

Wafer Production Method

Method for Thinning Solid Body Layers Provided with Components

Method for Modifying Substrates Based on Crystal Lattice Dislocatio...

Method for Separating Thin Layers of Solid Material from a Solid Body

METHOD AND DEVICE FOR PRODUCING PLANAR MODIFICATIONS IN SOLID BODIES

Method for Separating Solid Body Layers from Composite Structures M...

Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...

Combined wafer production method with laser treatment and temperatu...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

COMBINED LASER TREATMENT OF A SOLID BODY TO BE SPLIT

COMBINED PRODUCTION MEHTOD FOR SEPARATING A NUMBER OF THIN LAYERS O...

POLYMER HYBRID MATERIAL FOR USE IN A SPLITTING METHOD