Jan van KEMPEN

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Cuyk, NL

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Patents Grantslast 30 patents

Information Patent Grant
Pre-soldered leadless package
- Patent number 9,153,529
- Issue date Oct 6, 2015
- NXP B.V.
- Jan van Kempen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-soldered leadless package
- Patent number 8,728,929
- Issue date May 20, 2014
- NXP B.V.
- Jan van Kempen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device having improved locking properties
- Patent number 8,541,786
- Issue date Sep 24, 2013
- NXP B.V.
- Rene Wilhelmus Johannes Maria van den Boomen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRE-SOLDERED LEADLESS PACKAGE
- Publication number 20140211442
- Publication date Jul 31, 2014
- NXP B.V.
- Jan van KEMPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED LOCKING PROPERTIES
- Publication number 20110309514
- Publication date Dec 22, 2011
- NXP B.V.
- René Wilhelmus Johannes Maria van den Boomen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-SOLDERED LEADLESS PACKAGE
- Publication number 20110147925
- Publication date Jun 23, 2011
- NXP B.V.
- Jan van KEMPEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR