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Janak G. Patel
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South Burlington, VT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Heat sink configuration for multi-chip module
Patent number
11,810,832
Issue date
Nov 7, 2023
MARVELL ASIA PTE. LTD.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,682,646
Issue date
Jun 20, 2023
MARVELL ASIA PTE. LTD.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,171,104
Issue date
Nov 9, 2021
Marvell Asia Pte, Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shielded package assemblies with integrated capacitor
Patent number
11,049,819
Issue date
Jun 29, 2021
International Business Machines Corporation
Mark C. Lamorey
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Reduced-warpage laminate structure
Patent number
10,685,919
Issue date
Jun 16, 2020
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shielded package assemblies with integrated capacitor
Patent number
10,553,544
Issue date
Feb 4, 2020
International Business Machines Corporation
Mark C. Lamorey
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Thermally enhanced package to reduce thermal interaction between dies
Patent number
10,461,067
Issue date
Oct 29, 2019
GLOBALFOUNDRIES Inc.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink attachment on existing heat sinks
Patent number
10,342,160
Issue date
Jul 2, 2019
International Business Machines Corporation
Louis-Marie Achard
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible heat spreader lid
Patent number
10,224,262
Issue date
Mar 5, 2019
GLOBALFOUNDRIES Inc.
Kathryn C. Rivera
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded package assemblies with integrated capacitor
Patent number
9,935,058
Issue date
Apr 3, 2018
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink attachment on existing heat sinks
Patent number
9,883,612
Issue date
Jan 30, 2018
International Business Machines Corporation
Louis-Marie Achard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced package to reduce thermal interaction between dies
Patent number
9,859,262
Issue date
Jan 2, 2018
GLOBALFOUNDRIES Inc.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced-warpage laminate structure
Patent number
9,613,915
Issue date
Apr 4, 2017
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit for detecting structural defects in an integrated circuit c...
Patent number
9,599,664
Issue date
Mar 21, 2017
GLOBALFOUNDRIES Inc.
Luke D. Lacroix
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced-warpage laminate structure
Patent number
9,543,255
Issue date
Jan 10, 2017
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded package assemblies with integrated capacitor
Patent number
9,531,209
Issue date
Dec 27, 2016
International Business Machines Corporation
Mark C. Lamorey
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Packages for three-dimensional die stacks
Patent number
9,252,101
Issue date
Feb 2, 2016
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic module EMI shielding structures and methods
Patent number
9,245,854
Issue date
Jan 26, 2016
GLOBALFOUNDRIES Inc.
William L. Brodsky
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Shielded package assemblies with integrated capacitor
Patent number
9,209,141
Issue date
Dec 8, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced three-dimensional integrated circuit package
Patent number
9,190,399
Issue date
Nov 17, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures having off-axis in-hole capacitor
Patent number
9,185,807
Issue date
Nov 10, 2015
GlobalFoundries U.S. 2 LLC
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit structures having off-axis in-hole capacitor and...
Patent number
9,078,373
Issue date
Jul 7, 2015
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit for detecting structural defects in an integrated circuit c...
Patent number
9,057,760
Issue date
Jun 16, 2015
International Business Machines Corporation
Luke D. Lacroix
G01 - MEASURING TESTING
Information
Patent Grant
Packages for three-dimensional die stacks
Patent number
9,059,127
Issue date
Jun 16, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power distribution for 3D semiconductor package
Patent number
9,018,040
Issue date
Apr 28, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elongated via structures
Patent number
8,999,846
Issue date
Apr 7, 2015
International Business Machines Corporation
Luke D. LaCroix
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic module EMI shielding structures and methods
Patent number
8,952,503
Issue date
Feb 10, 2015
International Business Machines Corporation
William L. Brodsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elongated via structures
Patent number
8,759,977
Issue date
Jun 24, 2014
International Business Machines Corporation
Luke D. LaCroix
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for monitoring stress induced failures in interlevel diel...
Patent number
8,653,662
Issue date
Feb 18, 2014
International Business Machines Corporation
Luke D. LaCroix
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor test chip device to mimic field thermal mini-cycles t...
Patent number
8,586,982
Issue date
Nov 19, 2013
International Business Machines Corporation
Luke D. LaCroix
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
Three-Dimensional Device Package with Vertical Heat Pipes
Publication number
20230260871
Publication date
Aug 17, 2023
Marvell Asia Pte Ltd.
Janak G. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS
Publication number
20230197635
Publication date
Jun 22, 2023
Marvell Asia Pte Ltd.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
heat dissipation and electrical robustness in a three-dimensional p...
Publication number
20230035100
Publication date
Feb 2, 2023
Marvell Asia Pte Ltd.
Janak G. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CARRIER STACKED PACKAGE ASSEMBLY METHOD
Publication number
20220270909
Publication date
Aug 25, 2022
Marvell Asia Pte Ltd.
Richard Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
Publication number
20220059488
Publication date
Feb 24, 2022
Marvell Asia Pte, Ltd.
Manish NAYINI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heat Sink Configuration for Multi-Chip Module
Publication number
20210407879
Publication date
Dec 30, 2021
Marvell Asia Pte, Ltd.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
Publication number
20210125952
Publication date
Apr 29, 2021
Marvell International Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
Publication number
20200083177
Publication date
Mar 12, 2020
International Business Machines Corporation
Mark C. Lamorey
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
Publication number
20190378829
Publication date
Dec 12, 2019
GLOBALFOUNDRIES INC.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE HEAT SPREADER LID
Publication number
20180331011
Publication date
Nov 15, 2018
GLOBALFOUNDRIES INC.
Kathryn C. Rivera
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
Publication number
20180068993
Publication date
Mar 8, 2018
GLOBALFOUNDRIES Inc.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
Publication number
20180068957
Publication date
Mar 8, 2018
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
Publication number
20180054915
Publication date
Feb 22, 2018
International Business Machines Corporation
Louis-Marie Achard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
Publication number
20180012878
Publication date
Jan 11, 2018
GLOBALFOUNDRIES INC.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
Publication number
20170148749
Publication date
May 25, 2017
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
Publication number
20170125358
Publication date
May 4, 2017
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SINK ATTACHMENT ON EXISTING HEAT SINKS
Publication number
20160360645
Publication date
Dec 8, 2016
International Business Machines Corporation
Louis-Marie Achard
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
Publication number
20160155708
Publication date
Jun 2, 2016
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
Publication number
20160157357
Publication date
Jun 2, 2016
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
Publication number
20150349565
Publication date
Dec 3, 2015
International Business Machines Corporation
Mark C. Lamorey
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
THERMALLY ENHANCED THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE
Publication number
20150255441
Publication date
Sep 10, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT FOR DETECTING STRUCTURAL DEFECTS IN AN INTEGRATED CIRCUIT C...
Publication number
20150247896
Publication date
Sep 3, 2015
International Business Machines Corporation
Luke D. Lacroix
G01 - MEASURING TESTING
Information
Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
Publication number
20150243609
Publication date
Aug 27, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR
Publication number
20150245491
Publication date
Aug 27, 2015
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGES FOR THREE-DIMENSIONAL DIE STACKS
Publication number
20150214155
Publication date
Jul 30, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR AND...
Publication number
20150195914
Publication date
Jul 9, 2015
International Business Machines Corporation
Mark C. Lamorey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGES FOR THREE-DIMENSIONAL DIE STACKS
Publication number
20150194364
Publication date
Jul 9, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION FOR 3D SEMICONDUCTOR PACKAGE
Publication number
20150091131
Publication date
Apr 2, 2015
International Business Machines Corporation
Mark C. Lamorey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
Publication number
20150033554
Publication date
Feb 5, 2015
International Business Machines Corporation
William L. Brodsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELONGATED VIA STRUCTURES
Publication number
20140227874
Publication date
Aug 14, 2014
International Business Machines Corporation
Luke D. LaCroix
H01 - BASIC ELECTRIC ELEMENTS